Parallel Concurrent Test System for Semiconductor Devices

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Solution Overview

Problem

Automated semiconductor test equipment experiences significant idle time due to mechanical manipulations, limiting the efficiency and cost-effectiveness of testing processes, particularly in semiconductor manufacturing where reducing index time can lead to greater returns on investment and improved economic gains.

Innovation Solution

Implementing a Parallel Concurrent Test (PCT) system that re-configures sequential test flows into a more efficient two-pass test flow using a single integrated handler, allowing for parallel concurrent testing of semiconductor devices with broadside and design-for-test (DFT) testing, thereby reducing overall test time and increasing device utilization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If mechanical manipulation speed is increased to reduce index time, then productivity is improved, but device complexity and cost increase due to faster equipment requirements

Engineering Contradiction:
Improveindex timeVSAvoidequipment complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent segments the testing process into two distinct passes: a broadside testing pass and a DFT testing pass. This segmentation allows each pass to be optimized independently, with the broadside pass handling high-speed initial testing and the DFT pass handling detailed functional testing. By dividing the monolithic testing process into separate stages, the system achieves high productivity without requiring all components to operate at maximum speed simultaneously, thereby reducing overall equipment complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a temporal dimension to the testing process by implementing parallel concurrent testing within the broadside pass. Multiple devices are tested simultaneously in different test sockets, transforming a sequential single-device testing approach into a parallel multi-device approach. This dimensional change allows the system to increase productivity by testing multiple devices concurrently rather than requiring faster single-device testing, thus avoiding the need for increasingly complex high-speed mechanical manipulation equipment.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If mechanical manipulation speed is increased to reduce index time, then productivity is improved, but reliability deteriorates due to increased risk of device damage and contamination

Engineering Contradiction:
Improveindex timeVSAvoiddevice integrity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

By segmenting the test flow into separate broadside and DFT passes with distinct socket configurations, the patent allows each pass to use manipulation speeds appropriate to its requirements. The broadside pass can use faster speeds for initial placement, while the DFT pass uses slower, more careful manipulation. This segmentation enables productivity improvement in the broadside pass without compromising device integrity in the DFT pass, as each stage can be optimized independently for its specific speed and handling requirements.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The broadside testing pass serves as a preliminary action that screens devices before they undergo the more delicate DFT testing. By performing initial high-speed broadside testing first, the system can identify and remove obviously defective devices before they proceed to the slower, more careful DFT testing stage. This preliminary filtering protects subsequent testing stages from processing known-defective devices, thereby maintaining device integrity while allowing faster overall throughput.

Inventive Principle:
Principle #10Preliminary action

3Device complexity

If sequential test flow is used, then device complexity is reduced, but productivity deteriorates due to significant idle time in tester

Engineering Contradiction:
Improvesystem complexityVSAvoidtester utilization
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The patent segments the testing process into two distinct passes that can be executed in parallel concurrent fashion. The broadside testing pass and DFT testing pass are separated into different socket configurations, allowing the tester to perform broadside testing on one device while simultaneously performing DFT testing on another device in a different socket. This segmentation transforms the sequential test flow into a parallel structure, dramatically improving tester utilization without requiring complex coordination between multiple testers.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent adds a spatial dimension to the testing process by implementing parallel concurrent testing across multiple test sockets. Instead of testing devices sequentially in a single socket, the system uses multiple sockets to test multiple devices simultaneously at different stages of the test flow. This dimensional change from single-socket sequential testing to multi-socket parallel testing increases productivity by keeping the tester continuously utilized across multiple devices, while the underlying system architecture remains relatively simple.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS9817062B2Parallel concurrent test system and method
Publication Date: 2017.11.14 CELERINT LLC
  • US9817062B2 patent drawing
  • US9817062B2 patent drawing
  • US9817062B2 patent drawing

AI summary

A parallel concurrent test (PCT) system is provided for performing the parallel concurrent testing of semiconductor devices. The PCT system includes a pick and place (PnP) handler for engaging and transporting the semiconductor devices along a testing plane, the PnP handler including at least one manipulator. The PCT system also includes a device under test interface board (DIB), the DIB including a broadside test socket for broadside (BS) testing of the semiconductor devices, the broadside testing using at least half of a total number of a semiconductor device pins, and a plurality of design-for-test (DFT) test sockets for DFT testing, the DFT testing using less than half of the total number of the semiconductor device pins, and a tester in electrical contact with the DIB for testing the semiconductor devices in accordance with a stepping pattern test protocol.