Parallel-connected condensation device
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Solution Overview
Problem
Conventional heat dissipation devices face inefficiencies in heat exchange due to limited space for increased contact area and reduced cooling speed with increased airflow, leading to potential overheating and reduced service life of electronic products.
Innovation Solution
A parallel-connected condensation device comprising a front and rear condensation unit with vertically spaced heat dissipation tubes and heat dissipation fins that extend through grooves between the tubes, forming flow channels for enhanced heat exchange and cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the area of contact of the condenser is increased by widening the condenser perpendicular to the airflow, then the overall heat exchange rate is enhanced, but the condenser takes up too much space
Solution Approach 1:
The patent transitions from a single-plane condenser design to a multi-layer stacked configuration. By arranging multiple condensation units in layers along the airflow direction (third dimension), the total heat exchange area is increased without widening the condenser in the perpendicular direction. Each layer contains heat dissipation tubes arranged in parallel, creating multiple flow channels that collectively provide enhanced heat exchange capacity while maintaining a compact footprint.
2Power
If the total length of heat dissipation tubes is increased to expose more refrigerant to heat, then the overall heat exchange rate is enhanced, but the cooling speed may remain unchanged or even lower as airflow increases
Solution Approach 1:
The patent divides the heat dissipation tube system into multiple independent parallel flow channels within each condensation unit. Instead of using a single long tube, multiple shorter tubes are arranged in parallel, each handling a portion of the refrigerant flow. This segmentation allows refrigerant to be distributed across multiple pathways, increasing the effective heat exchange surface area exposed to airflow while maintaining shorter individual tube lengths that respond more quickly to thermal changes, thereby preserving cooling speed.
3Device complexity
If a single condensation unit is used, then the device structure is simple, but the heat dissipation efficiency is limited due to space constraints
Solution Approach 1:
The patent merges multiple condensation units into a single integrated condenser assembly. Multiple condensation units, each containing parallel flow channels, are stacked and connected through communication chambers that allow refrigerant flow between units. This merging creates a multi-layer structure where the combined heat dissipation capacity of all units works together, significantly enhancing overall heat dissipation efficiency while maintaining a unified device structure that manages complexity through systematic integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates effective heat exchange and improves cooling efficiency by connecting the front and rear condensation units in parallel, reducing the difference in heat dissipation efficiency and providing rapid heat removal from electronic components.
Implementation Method 1
the heat dissipation device to dissipate heat through thermal conduction or convection
Implementation Method 2
the heat dissipation device to dissipate heat through thermal conduction or convection
Implementation Method 3
the transition between liquid and gaseous states, of the refrigerant while the refrigerant absorbs or releases heat
Implementation Method 4
A plurality of heat dissipation fins are inserted in the through grooves respectively and thereby extend through the front condensation unit and the rear condensation unit, wherein the heat dissipation fins are in contact with surfaces of the front heat dissipation tubes and surfaces of the rear heat dissipation tubes to enable heat exchange between the heat dissipation fins and the heat dissipation tubes
Data Source
AI summary
The present invention provides a parallel-connected condensation device, comprising a front condensation unit, a rear condensation unit, and a plurality of heat dissipation fins. The front condensation unit is parallel to the rear condensation unit. The heat dissipation fins is inserted into the front condensation unit and the rear condensation unit. The front condensation unit and the rear condensation unit comprise a plurality of confluence chambers. The confluence chambers are connected with each other to form a plurality of flow channels.