Parallel Cooling Units for Low-Resistance Power Electronics Cooling
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Solution Overview
Problem
Conventional cooling systems for high-power electrical and electronic devices face challenges such as high thermal resistance, inefficiency in heat dissipation, and difficulty in managing heat buildup, especially in components like magnetic devices, leading to potential thermal runaway and reduced power output.
Innovation Solution
A cooling arrangement featuring low-thermal-resistance heat exchange surfaces and fluid transfer means, combined with magnetic devices, to efficiently collect and dissipate heat from power electronics assemblies, utilizing hollow elongated bodies with fins and fluid transfer mechanisms like fans or pumps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat sinks are used for cooling, then heat dissipation surface area is increased, but thermal resistance remains high and cooling efficiency is insufficient
Solution Approach 1:
The patent employs liquid cooling channels integrated into the heat sink structure, allowing coolant to flow through internal passages for efficient heat removal. This hydraulic approach replaces conventional air cooling with liquid circulation, achieving superior thermal management for high-power electronic components
Solution Approach 2:
The invention combines multiple cooling functions into a single integrated heat sink assembly that serves both power electronic components and magnetics components. The unified structure merges separate cooling requirements into one system, reducing overall thermal resistance and improving cooling effectiveness
2Temperature
If forced air cooling is implemented, then heat transfer to surrounding air is facilitated, but clear path for driving out warm air is absent and cooling effectiveness is reduced
Solution Approach 1:
The heat sink is divided into distinct cooling zones with separate airflow channels for different component regions. This segmentation creates dedicated pathways for cool air intake and warm air exhaust, ensuring efficient forced convection without airflow interference between zones
Solution Approach 2:
The patent introduces thermal interface materials and heat transfer fluids as intermediaries between heat-generating components and the cooling structure. These intermediaries facilitate efficient heat transfer from components to the heat sink, overcoming thermal resistance barriers
3Adaptability or versatility
If magnetics components are included in the assembly, then functional capability is enhanced, but component size increases and space utilization is reduced
Solution Approach 1:
The patent nests magnetics components within the heat sink structure, placing them in internal cavities or between heat sink layers. This nesting approach allows magnetics components to be integrated without significantly increasing the overall assembly footprint, achieving high power density
4Loss of energy
If power ratings are minimized to reduce losses, then efficiency is improved, but maintaining adequate cooling and performance becomes challenging
Solution Approach 1:
The invention optimizes thermal parameters including coolant flow rate, heat sink surface area, and thermal conductivity materials to achieve efficient heat removal at reduced power levels. By adjusting these parameters, the system maintains effective cooling while operating at lower power ratings to minimize losses
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective and efficient cooling, minimizing thermal resistance, optimizing space utilization, and facilitating easy maintenance, while enhancing the performance and reliability of high-power magnetic components.
Implementation Method 1
heat exchange surfaces with low thermal resistance... facilitates collection of heat, which may be generated by the electrical or electronic components
Implementation Method 2
fluid transfer means allows dissipation of the collected heat by enabling passage of fluids through the cooling units
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~4
AI summary
Disclosed is a cooling arrangement (100), comprising: a first cooling unit (120) having a first hollow elongated body (122) that provides a passage for a fluid to flow through the first cooling unit (120); a second cooling unit (140), arranged parallel to and spaced apart from the first cooling unit (120), having a second hollow elongated body (142) that provides a passage for a fluid to flow through the second cooling unit (140); one or more magnetic devices (160) arranged between the first cooling unit (120) and the second cooling unit (140); and one or more fluid transfer means (180, 190, 192) that enable transfer of fluid through the first cooling unit (120) and the second cooling unit (140).