Parallel Fluid Cooling Assembly for High-Density Computing Systems
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-density computing systems in datacenters generate excessive waste heat, which existing air cooling and series fluid-flow cooling mechanisms struggle to dissipate effectively, leading to thermal issues and potential equipment failure.
Innovation Solution
A parallel fluid-flow cooling mechanism with a tool-less design, where a fluid chamber and multiple cooling components are connected via quick-disconnect connectors, allowing for efficient heat dissipation without the need for extensive plumbing modifications or specialized tools, enabling each cooling component to receive cooled liquid directly and discharge heated liquid efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling systems are used to circulate air to computing systems, then cooling is provided, but excessive waste heat from high-density computing systems cannot be dissipated effectively
Solution Approach 1:
The patent transitions from air cooling to liquid coolant-based cooling systems. The fluid cooling assembly uses liquid coolant flowing through channels in cold plates to absorb heat from high-density computing components, providing more effective waste heat dissipation than air cooling while maintaining scalability.
2Temperature
If series fluid-flow cooling mechanism is used, then heat dissipation is achieved, but installation requires extensive plumbing modifications and specialized tools
Solution Approach 1:
The fluid cooling assembly is divided into modular components including a fluid chamber, multiple cold plates with integrated channels, and quick-disconnect connectors. Each cold plate can be independently installed on different computing components, and the modular design allows for tool-less assembly through simple connector engagement without requiring extensive plumbing modifications.
Solution Approach 2:
The cold plates are pre-formed with integrated fluid channels during manufacturing, eliminating the need for field routing or modification of cooling passages. The quick-disconnect connectors are pre-configured to enable rapid connection and disconnection of fluid pathways without requiring tools or complex assembly procedures.
3Temperature
If traditional fluid cooling systems are used, then waste heat is dissipated, but maintenance and service processes are complex and time-consuming
Solution Approach 1:
The modular cold plate design allows individual components to be independently accessed, removed, and replaced without affecting the entire cooling system. The quick-disconnect connectors enable rapid disassembly of fluid pathways, facilitating easy maintenance and service operations while maintaining effective waste heat dissipation across the computing system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates waste heat from high-density computing systems, preventing thermal damage and allowing for easier maintenance by simplifying the installation and service processes, while maintaining system performance and reliability.
Implementation Method 1
each cooling component transfers a waste-heat absorbed from the respective electronic component to the cooled liquid-coolant
Implementation Method 2
dissipates the waste-heat from the computing system by directing the received cooled liquid-coolant to establish a thermal contact with the plurality of electronic components
Data Source
AI summary
Example implementations relate to a fluid cooling assembly for a computing system, and a tool-less method of installing the fluid cooling assembly to the computing system. The fluid cooling assembly includes a plurality of cooling components, and a fluid chamber having a plurality of first fluid connectors. Further, each cooling component includes a plurality of second fluid connectors. Each first fluid connector or each second fluid connector includes a first end to protrude beyond a first surface of a circuit board of the computing system, and a second end to protrude beyond a second surface of the circuit board. Further, the first end of each first fluid connector is connected to the first end of a respective second fluid connector via the circuit board, to establish a parallel fluid flow path between the fluid chamber and each of the plurality of cooling components.