Parallel Fluid Cooling Fixtures for Uniform Microprocessor Temperatures
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Solution Overview
Problem
Existing fluid-based cooling systems for electrically-powered devices result in uneven cooling due to heating of cooling fluid as it passes through multiple devices in series, leading to varying levels of damage and performance across the array of devices, particularly affecting uniformity in greenhouse farming applications.
Innovation Solution
A thermal management system with base thermal management fixtures that receive cooling fluid, direct it to absorb heat from a device, and expel heated waste fluid, ensuring each fixture receives only non-heated cooling fluid, either in parallel or serial configurations, eliminating the need for extensive heat sinks and allowing use of lightweight materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If cooling fluid flows in serial through multiple electrically-powered devices, then the system structure is simplified, but the cooling uniformity deteriorates as the fluid becomes progressively heated
Solution Approach 1:
The system divides the cooling fluid flow into multiple parallel channels, with each channel dedicated to a specific device or group of devices. This segmentation ensures that each device receives cooling fluid at a consistent temperature, eliminating the progressive heating issue inherent in serial flow configurations while maintaining system simplicity through modular channel design.
2Use of energy by moving object
If cooling fluid is reused across multiple devices, then energy efficiency is improved, but device performance consistency deteriorates due to varying cooling levels
Solution Approach 1:
The cooling system is segmented into independent parallel channels, where cooling fluid is distributed simultaneously to multiple devices rather than flowing sequentially. This allows the system to maintain energy efficiency by circulating cooling fluid through all devices in one cycle, while ensuring each device receives consistent cooling conditions, thereby achieving both energy efficiency and performance consistency.
3Ease of manufacture
If serial fluid communication is used among devices, then the cooling system is easier to implement, but device damage risk increases due to uneven cooling
Solution Approach 1:
The system implements parallel fluid channels that can be independently configured for each device, providing uniform cooling conditions. This segmentation approach maintains ease of implementation through modular design while eliminating the progressive heating effect that causes device damage in serial configurations, as each device operates in its own dedicated cooling zone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures uniform cooling across multiple devices, reducing device damage and maintaining consistent performance, while potentially lowering costs through the use of lightweight materials and eliminating the need for expensive metal frames.
Implementation Method 1
the cooling fluid can absorb heat from the at least one electrically-powered device and become heated waste fluid
Data Source
AI summary
Described herein are devices, systems and methods for utilizing fluid cooling to thermally manage electrically-powered devices such as microprocessors and microprocessor chips. Embodiments incorporating features of the present disclosure can purge heated cooling fluid from the system immediately after it has been used to absorb heat from an electrically-powered device, so that other devices in the system do not receive cooling fluid from another device in the system. In some embodiments, cooling fluid can be made to directly impinge on or near an electrically-powered device such as a microprocessor or microprocessor chip.