Parallel Heat Exchanger Layout With Airflow Clearances
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Solution Overview
Problem
Existing heat exchanger designs lack a compact and efficient thermal coupling mechanism between cooling circuits, which hampers effective heat transfer and can lead to increased size and energy consumption in cooling systems for electronics and vehicles.
Innovation Solution
A heat exchanger arrangement featuring a first heat absorbing section and a second heat releasing section with multiple fluid guiding means thermally coupled in a serpentine configuration, including a third heat absorbing section forming a heat pipe or thermosiphon cooling circuit, and utilizing heat sinks and airflow regulation flaps to enhance thermal coupling and airflow management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple heat exchange structures are arranged in parallel in a plane of extension with thermal coupling between fluid guiding means, then heat transfer efficiency is improved and compactness is achieved, but device complexity increases
Solution Approach 1:
The heat exchanger is divided into multiple discrete heat exchange structures arranged in parallel, each with its own fluid guiding means. This segmentation allows independent optimization of each unit while achieving overall high heat transfer efficiency through the combined parallel arrangement, resolving the contradiction between productivity and complexity by making the complex structure modular and manageable.
Solution Approach 2:
The heat exchange structures are arranged in a plane of extension rather than stacked in three dimensions, creating a two-dimensional parallel configuration. This dimensional approach allows multiple heat exchange surfaces to coexist without vertical interference, achieving compact heat transfer area while maintaining manufacturable complexity levels through planar layout.
2Reliability
If a third heat absorbing section is added to form a heat pipe or thermosiphon cooling circuit, then thermal coupling efficiency is improved, but device complexity increases
Solution Approach 1:
The third heat absorbing section is integrated with the existing heat exchange structures to form a unified heat pipe or thermosiphon cooling circuit. This merging combines multiple thermal management functions into a single integrated system, improving thermal coupling efficiency while avoiding the complexity of separate independent cooling circuits.
Solution Approach 2:
The heat pipe or thermosiphon cooling circuit operates on passive thermal principles without requiring external power or active control mechanisms. The system self-regulates heat transfer through phase change and thermal conduction, improving reliability through self-service operation while minimizing the complexity of control systems and external dependencies.
3Loss of energy
If clearances are disposed between adjacent heat exchange structures to allow airflow, then heat dissipation is improved, but device volume increases
Solution Approach 1:
Clearances are strategically disposed between specific adjacent heat exchange structures where airflow is most beneficial for heat dissipation, rather than uniformly spacing all structures. This local application of airflow channels optimizes heat dissipation efficiency in critical areas while minimizing the overall volume increase that would result from uniform spacing throughout the entire heat exchanger assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves a compact and efficient thermal coupling, improving heat transfer efficiency while allowing for the use of refrigerants with low Global Warming Potential, thus enhancing the environmental friendliness and performance of cooling systems.
Implementation Method 1
each heat exchange structure comprises at least one fluid guiding means of the first plurality and at least one fluid guiding means of the second plurality thermally coupled to each other
Implementation Method 2
each heat exchange structure comprises a heat sink to thermally couple the at least one fluid guiding means of the first plurality and the at least fluid guiding means of the second plurality
Implementation Method 3
the second heat releasing section and the third heat absorbing section form a first cooling circuit, wherein the first cooling circuit is a heat pipe, a thermosiphon, or a pulsating heat pipe
Implementation Method 4
the first cooling circuit is a heat pipe, a thermosiphon, or a pulsating heat pipe
Data Source
Figure 1
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AI summary
A heat exchanger arrangement (100), comprising a first heat absorbing section (10) and a second heat releasing section (11) is proposed, wherein a plurality of heat exchange structures (12) are arranged, preferably in parallel to each other, in a plane of extension (13), wherein the first heat absorbing section (10) comprises a first plurality of fluid guiding means (14) and wherein the second heat releasing section (11) comprises a second plurality of fluid guiding means (15), wherein each heat exchange structure (12) comprises at least one fluid guiding means (14) of the first plurality and at least one fluid guiding means (15) of the second plurality thermally connected to each other, and preferably arranged in parallel to each other, wherein a clearance (16) is disposed between two adjacent heat exchange structures (12) to allow airflow between the adjacent heat exchange structures (12) and/or wherein each heat exchange structure (12) comprises a heat sink (69) to thermally couple the at least one fluid guiding means (14) of the first plurality and the at least one fluid guiding means (15) of the second plurality.