Parallel Heat Shield Assembly for Cryo Pump Thermal Isolation
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Solution Overview
Problem
Cryo pumps in semiconductor substrate processing systems face challenges in maintaining high vacuum due to thermal energy generated within the processing chambers, which existing heat shields inadequately protect, leading to reduced efficiency.
Innovation Solution
A heat shield assembly comprising multiple shields in a parallel configuration, including a circular plate and annular shields with central openings, arranged to block thermal radiation while allowing gas flow, effectively protecting the cryo pump from thermal energy and maintaining vacuum integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a single heat shield is used to protect the cryo pump, then the pump is partially shielded from thermal energy, but the shielding is insufficient and the pump temperature increases
Solution Approach 1:
The heat shield is divided into multiple segments (first heat shield, second heat shield, third heat shield) arranged in parallel. Each segment provides a portion of the thermal protection, and together they create a comprehensive shielding system that effectively blocks thermal radiation from reaching the cryo pump while maintaining structural integrity.
2Length of stationary object
If the cryo pump is placed closer to the chamber, then the system size is reduced, but the pump is exposed to more thermal energy from chamber sources
Solution Approach 1:
The parallel heat shield assembly acts as an intermediary structure between the process chamber and the cryo pump. It provides thermal isolation while allowing the pump to be positioned at an optimized distance from the chamber, blocking thermal radiation pathways without requiring excessive spacing.
3Object-affected harmful factors
If multiple heat shields are used to improve shielding, then thermal protection is enhanced, but the device complexity increases
Solution Approach 1:
Multiple heat shields are merged into a single parallel assembly structure that functions as one integrated component. The first, second, and third heat shields are positioned parallel to each other and work together as a unified shielding system, reducing the complexity of individual component mounting while maintaining effective thermal protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat shield assembly efficiently protects cryo pumps from thermal energy, ensuring high vacuum maintenance and extending the cryo pump's ability to adsorb gases, thereby enhancing the overall performance of semiconductor substrate processing systems.
Implementation Method 1
shielding cryo pumps from thermal energy generated within processing chambers
Implementation Method 2
The cryo pump adsorbs gases when cold, then progressively loses the ability to adsorb gases as the cryo pump temperature increases
Data Source
AI summary
Embodiments of heat shield assemblies for a processing chamber are provided herein. In some embodiments, a heat shield assembly for a processing chamber includes: a first shield comprising a circular plate; a second shield coupled to the first shield and in a parallel configuration with the first shield, wherein the second shield has an outer diameter greater than an outer diameter of the first shield and the second shield includes a central opening having a diameter smaller than an outer diameter of the first shield; and a third shield coupled to and in a parallel configuration with the second shield, wherein an outer diameter of the third shield is greater than the diameter of the central opening of the second shield.