Parallel IC Chip Power Distribution on Single Coil Antenna
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Solution Overview
Problem
When multiple IC chips for contactless communication are connected to a single coil antenna, existing technologies fail to supply power appropriately to each chip according to their respective communication characteristics, leading to unsatisfied communication requirements such as communication coverage distance and dead zones.
Innovation Solution
The solution involves connecting multiple IC chips in parallel to a single coil antenna, where each chip receives a different amount of power by being connected to different points on the coil, allowing for tailored power supply based on their specific communication characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple IC chips are connected in parallel to a single coil antenna, then the device complexity is reduced and circuit area is saved, but the power supply to each IC chip cannot be appropriately controlled according to their respective communication characteristics
Solution Approach 1:
The patent applies local quality by connecting each IC chip to a different portion or turn of the coil antenna, so that each chip receives a different amount of power tailored to its specific communication characteristics. This allows different parts of the system (each IC chip connection point) to have different power supply qualities, resolving the contradiction between simplified device structure and reliable communication performance.
2Ease of manufacture
If a single coil antenna is used for multiple IC chips, then the manufacturing cost is reduced and ease of manufacture is improved, but the power distribution to each chip cannot be optimized for their specific communication requirements
Solution Approach 1:
The patent implements local quality by creating different power supply conditions at different connection points on the coil antenna. Each IC chip is connected to a specific location on the coil that provides the appropriate power level for its communication requirements, enabling optimized energy distribution while maintaining a single antenna structure for ease of manufacture.
3Reliability
If IC chips are connected to different points on the coil antenna, then appropriate power supply to each chip is achieved, but the device complexity increases
Solution Approach 1:
The patent merges multiple IC chip connections into a single coil antenna structure, combining what could be separate antenna systems into one unified component. This approach maintains reliability by providing different power levels to each chip through strategic connection points, while avoiding the need for multiple separate antennas that would increase device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables appropriate power supply to each IC chip, ensuring that their communication characteristics are met, even in devices with limited circuit area, such as electronic cards, without the need for separate coil antennas.
Implementation Method 1
a coil antenna configured to receive an external magnetic field and thereby generate power
Data Source
AI summary
An information processing device that includes a coil antenna is configured to receive an external magnetic field and thereby generate power, and a first IC chip and a second IC chip each connected in parallel to the coil antenna and configured to receive power supplied from the coil antenna. Power received by the first IC chip from the coil antenna is different from power received by the second IC chip from the coil antenna.