Parallel Component Transfer Using Laser Release Beamlets
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Solution Overview
Problem
Existing methods for assembling discrete components onto a substrate are inefficient and lack the ability to perform high-throughput, low-cost, and precise transfer of ultra-thin, ultra-small components.
Innovation Solution
A laser-assisted transfer process using a dynamic release layer and diffractive optical elements to separate laser energy into multiple beamlets, inducing controlled ablation and deformation for concurrent release of components onto a target substrate, allowing for high-yield and precise placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional assembly methods are used to transfer discrete components onto a substrate, then the process is simple and low-cost, but the throughput is low and precision is poor
Solution Approach 1:
The patent segments the laser beam into multiple beamlets using diffractive optical elements, allowing simultaneous irradiation of multiple regions on the substrate. This enables parallel processing of multiple discrete components, dramatically increasing assembly throughput while maintaining precise placement accuracy
Solution Approach 2:
The patent replaces conventional mechanical transfer mechanisms with a laser-assisted release system. The laser irradiates specific regions to induce localized heating or ablation of the release layer, causing discrete components to be released and transferred to target positions without mechanical contact, thereby improving both throughput and precision
2Manufacturing precision
If conventional assembly methods are used, then equipment complexity is low, but manufacturing precision and placement accuracy are insufficient
Solution Approach 1:
The patent applies laser irradiation to specific local regions on the substrate where discrete components need to be transferred. The diffractive optical elements create spatially selective beam patterns that irradiate only the necessary areas, enabling precise placement while avoiding unnecessary heating or damage to other regions
Solution Approach 2:
The patent introduces a release layer as an intermediary between the discrete components and the substrate. The laser irradiates this release layer to induce localized changes (heating, softening, or ablation), which selectively releases components at precise positions. This intermediary mechanism enables accurate placement without requiring direct laser-component interaction
3Productivity
If individual component transfer is performed, then placement precision is achieved, but assembly time is excessive and productivity is low
Solution Approach 1:
The patent segments the laser beam into multiple beamlets that can simultaneously irradiate multiple regions on the substrate. This allows parallel release and transfer of multiple discrete components in a single operation, dramatically increasing assembly speed while maintaining precise placement through controlled beam positioning
Solution Approach 2:
The patent merges multiple laser beamlets into a coordinated pattern that simultaneously processes multiple discrete components. By combining the irradiation function across multiple regions, the system achieves parallel processing capability, transferring many components at once while maintaining the precision of individual placement through the coordinated beam pattern
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables ultra-fast, high-throughput assembly of discrete components with precise placement and increased yield, particularly suitable for transferring ultra-thin and ultra-small components like LEDs onto substrates for displays or solid state lighting.
Implementation Method 1
Irradiating the multiple regions includes irradiating the multiple regions with laser energy. The irradiating induces ablation of a partial thickness of the dynamic release layer in each of the irradiated regions.
Implementation Method 2
The ablation of the partial thickness of the dynamic release layer induces a deformation of a remaining thickness of the dynamic release layer in each of the irradiated regions.
Implementation Method 3
The method includes separating the laser energy with a diffractive optical element.
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 2C
AI summary
A method includes transferring multiple discrete components from a first substrate to a second substrate, including illuminating multiple regions on a top surface of a dynamic release layer, the dynamic release layer adhering the multiple discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The illuminating induces a plastic deformation in each of the irradiated regions of the dynamic release layer. The plastic deformation causes at least some of the discrete components to be concurrently released from the first substrate.