Parallel LED Wiring Structure for Heat Dissipation and Reliability
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Solution Overview
Problem
Conventional LED lamp products suffer from reduced service life due to high power consumption and difficulty in heat dissipation, especially as they become miniaturized, leading to issues with electrical connection and increased failure rates when one LED lamp bead is damaged.
Innovation Solution
A printed circuit board (PCB) arrangement and wiring structure for LED lamp beads, where VDD, DIN, and VSS pins are connected in parallel, allowing for independent control of each LED lamp bead and reducing the need for DOUT pins, thereby enhancing heat dissipation and reducing power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If LED lamp beads are connected in series with conventional wiring, then signal data can be transmitted from one LED lamp bead to the next, but when one LED lamp bead fails, all other LED lamp beads cannot work, reducing reliability
Solution Approach 1:
The patent divides the LED lamp bead system into independent parallel units, where each LED lamp bead is connected in parallel rather than series. This segmentation allows individual LEDs to operate independently, so when one fails, others continue to function, thereby improving reliability without increasing overall wiring complexity.
Solution Approach 2:
The patent merges multiple VDD pins and VSS pins into shared power supply lines that are connected in parallel across all LED lamp beads. This combining approach simplifies the wiring structure by reducing the number of separate connections needed while maintaining reliable parallel operation of all LEDs.
2Volume of moving object
If LED lamp beads are miniaturized to reduce product size, then product dimensions are reduced, but heat dissipation becomes increasingly difficult and electrical connection area decreases
Solution Approach 1:
The patent transitions from series wiring to parallel wiring architecture, which fundamentally changes the dimensional arrangement of electrical connections. This dimensional reorganization allows for larger effective connection areas and improved heat dissipation pathways even as the overall product volume is reduced through miniaturization.
Solution Approach 2:
The patent implements shared power supply lines (VDD and VSS) that serve multiple LED lamp beads simultaneously. This multi-functional approach allows the wiring structure to handle both electrical connection and heat dissipation functions efficiently, addressing thermal management challenges in miniaturized products without requiring separate dedicated pathways for each LED.
3Adaptability or versatility
If pins are densely distributed to accommodate more LED lamp beads, then product functionality is enhanced, but the area of electrical connection between every two pins becomes increasingly smaller, increasing manufacturing difficulty
Solution Approach 1:
The patent merges multiple pin connections into shared power supply lines (VDD and VSS) that serve multiple LED lamp beads. This consolidation increases the effective connection area for power and ground signals, making manufacturing more feasible even when pins are densely distributed to enhance product functionality.
Data Source
AI summary
Disclosed is a PCB arrangement and wiring structure of LED lamp beads, including a carrier board, and a VDD pin, a DIN pin, and a VSS pin are further arranged in the LED lamp bead installation area; similar pins are connected and wired in parallel with each other, and all the VSS pins are connected and wired in parallel with each other, so that the voltage between each set of lamp beads remains consistent; all the DIN pins are connected and wired in parallel with each other; and the carrier board is further provided with at least one set of VDD power input pin terminals, VSS power input pin terminals, and DIN control terminals, a plurality of the VDD pins are electrically connected to the VDD power input pin terminal, and a plurality of the VSS pins are electrically connected to the VDD power input pin terminal.