Parallel Memory Module Interface for Compact Immersion Servers

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Solution Overview

Problem

Existing memory modules coupled perpendicularly to circuit boards result in increased height, which is disadvantageous for applications requiring compactness, such as immersion servers, and may lead to inefficiencies in heat transfer and packaging costs.

Innovation Solution

Memory modules are coupled to circuit boards in a plane parallel to the circuit board's plane, allowing for a more compact design that can be stacked efficiently and facilitating better heat transfer through liquid immersion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If memory modules are coupled perpendicularly to circuit boards, then electrical coupling is achieved, but the vertical height increases which reduces compactness

Engineering Contradiction:

ImprovecompactnessVSAvoidvertical height

Core Design Contradiction:

Ease of operationVSLength of stationary object

Solution Approach 1:

The patent transitions from perpendicular coupling (vertical dimension) to parallel coupling (horizontal dimension), changing the orientation of the memory module relative to the circuit board. This dimensional change allows the memory module to extend in the plane of the circuit board rather than perpendicular to it, significantly reducing vertical height while maintaining electrical coupling through modified connector and socket geometries

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If memory modules are coupled perpendicularly to circuit boards, then connection is achieved, but heat transfer efficiency decreases

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidcoupling configuration

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent utilizes liquid immersion cooling by enabling the memory module to be coupled parallel to the circuit board, which facilitates better thermal contact with the cooling liquid. This configuration allows the heat dissipation surfaces of the memory module to be more effectively exposed to and immersed in the cooling liquid, enhancing heat transfer efficiency through convection and conduction mechanisms

Inventive Principle:

Principle #29Pneumatics and hydraulics

3Ease of manufacture

If memory modules are coupled perpendicularly to circuit boards, then standard connection is achieved, but packaging costs increase

Engineering Contradiction:

Improvepackaging costVSAvoidcoupling configuration

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent creates a universal coupling configuration where the memory module, circuit board, and connector are designed with parallel alignment capability. This multi-functional design allows the same interface structure to accommodate both electrical connection and improved thermal management, while also enabling more efficient packaging arrangements. The standardized parallel coupling interface can be applied across different device configurations, reducing overall system complexity and packaging costs

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS12446174B2Interfaces for coupling a memory module to a circuit board, and associated devices, modules, and systems

Publication Date: 2025.10.14 MICRON TECHNOLOGY INC

AI summary

This disclosure relates generally to interfaces between memory modules and circuit boards. More specifically, this disclosure relates to interfaces for coupling a memory module to a circuit board such that the memory module is arranged in a plane that is substantially parallel with a plane of the circuit board. Various embodiments disclosed herein include interfaces, memory modules including interfaces or portions of interfaces, and/or circuit boards including interfaces and/or portions of interfaces. Associated devices and systems are also disclosed.