Parallel Memory Socket Test Board for Multi-Rank Efficiency

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Solution Overview

Problem

The high cost and time required for testing semiconductor devices under real usage conditions, especially for memory modules with increased capacity, make accurate testing difficult and inefficient.

Innovation Solution

A memory mounting test system with a main board that includes sockets connected parallel to the substrate, a central processing unit, memory controller, and input/output control circuits, allowing for the application of address, control, and data signals to perform a mounting test by treating memory modules with multiple ranks as single ranks during the testing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If memory modules with multiple ranks are tested under real usage conditions, then testing accuracy is improved, but testing time and cost increase

Engineering Contradiction:
Improvetesting accuracyVSAvoidtesting time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The patent changes the operational parameters of the memory module during testing by configuring multi-rank memory modules to operate in single-rank mode. This is achieved by controlling the memory controller to access only one rank at a time, thereby simplifying the test configuration while maintaining realistic operating conditions. This parameter change reduces testing complexity and time while preserving testing accuracy for the most common usage scenario.

Inventive Principle:
Principle #35Parameter changes

2Measurement precision

If memory modules with multiple ranks are tested under real usage conditions, then testing accuracy is improved, but testing cost increases

Engineering Contradiction:
Improvetesting accuracyVSAvoidtesting cost
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent reduces testing cost by changing the operational parameters to single-rank mode during testing. This simplification reduces the complexity of test equipment requirements, shortens test cycle times, and lowers overall testing costs while still providing accurate results for the predominant single-rank access scenario that represents most real-world usage.

Inventive Principle:
Principle #35Parameter changes

3Productivity

If memory modules are tested as single ranks, then testing time and cost are reduced, but testing accuracy for multi-rank operations deteriorates

Engineering Contradiction:
Improvetesting efficiencyVSAvoidtesting accuracy for multi-rank operations
Core Design Contradiction:
ProductivityVSMeasurement precision

Solution Approach 1:

The patent applies partial action by testing only the most critical and common single-rank access operations in detail, while accepting that multi-rank operations are tested with reduced precision. This approach is justified because single-rank access represents the majority of real-world memory operations, and the patent provides a practical balance between testing thoroughness and efficiency by focusing resources on the most frequently occurring usage patterns.

Inventive Principle:
Principle #16Partial or excessive action

Data Source

PatentUS8125236B2Main board and system for memory mounting test
Publication Date: 2012.02.28 SAMSUNG ELECTRONICS CO LTD
  • US8125236B2 patent drawing
  • US8125236B2 patent drawing
  • US8125236B2 patent drawing

AI summary

A main board according to example embodiments may include a substrate and at least one socket. The at least one socket may directly connect a memory module to the substrate in a direction parallel to the substrate. A memory mounting test system including the main board may occupy a smaller space, because the memory module is connected to the main board in a direction parallel to the main board.