Parallel Microdriver Testing for μLED Defect Pinpointing
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Solution Overview
Problem
Current micro LED display manufacturing techniques are prone to placement and bonding imperfections due to reliance on pick-and-place and bonding technologies, leading to unnecessary costs from redundant components and inability to pinpoint defective microdrivers and row/column drivers in serial testing processes.
Innovation Solution
The implementation of parallel testing techniques that utilize bidirectional data lines to identify and pinpoint defective microdrivers and row/column drivers before or after micro LEDs are placed, reducing the need for redundant components and minimizing costs by enabling efficient identification of defective elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If pick-and-place and bonding technologies are used to manufacture micro LED displays, then integration of μLEDs, microdrivers, and row/column drivers is achieved, but placement and bonding imperfections occur leading to defective elements
Solution Approach 1:
The patent applies preliminary action by implementing a testing mechanism that identifies defective microdrivers and row/column drivers before final μLED placement. The test data output from each microdriver is captured and analyzed in advance, allowing defective elements to be detected and excluded before they cause manufacturing issues, thus preventing placement and bonding imperfections from occurring in the first place
Solution Approach 2:
The patent introduces an intermediary testing system that acts as a mediator between the microdrivers/row-column drivers and the final assembly process. This testing mechanism captures test data output from each microdriver and row/column driver, providing intermediate verification that identifies defective elements before they are integrated into the final display, thereby resolving the precision issue without compromising manufacturing ease
2Reliability
If redundant components are included to account for defective elements, then reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies feedback by implementing a testing mechanism that provides information about the actual quality of each microdriver and row/column driver. The test data output from each element is captured and analyzed, providing feedback that identifies which elements are defective and which are functional. This feedback eliminates the need for redundant components since only truly functional elements are selected for final assembly, thereby maintaining reliability while reducing waste and cost
Solution Approach 2:
The patent changes the parameter of component selection from a static approach (including redundant components) to a dynamic approach (selecting only functional components based on test results). By measuring and analyzing test data output from each microdriver and row/column driver, the system identifies defective elements and excludes them from final assembly. This parameter change allows for precise selection of functional components, eliminating the need for redundant parts and reducing manufacturing costs while maintaining display reliability
3Productivity
If serial testing processes are used to identify defective elements, then testing is performed, but the ability to pinpoint specific defective microdrivers and row/column drivers is lost
Solution Approach 1:
The patent applies segmentation by dividing the testing process into individual, independent test operations for each microdriver and row/column driver. Instead of a collective serial test, each element is tested separately with its own test data output captured independently. This segmentation allows the system to identify which specific element is defective based on its individual test results, thereby maintaining productivity while achieving precise identification of defective elements
Solution Approach 2:
The patent transitions from a one-dimensional serial testing approach to a multi-dimensional parallel testing architecture. Multiple test operations are performed simultaneously across different microdrivers and row/column drivers, with each test operating in its own dimension or channel. This dimensional change allows all elements to be tested in parallel (maintaining productivity) while each element's test results can be independently analyzed (achieving precise identification of defective elements)
Data Source
AI summary
The present techniques are capable of identifying and pinpointing defective microdrivers and/or row/column drivers either before or after any μLEDs have been placed on the display. Using the architectures described herein, test data may be delivered in a parallel fashion to the drivers from support circuitry, such as a timing controller and/or a main board, and outputs based on the test data may be similarly delivered back to the support circuitry do determine which drivers are defective. This yields access to the output of every microdriver and row drier, thus enabling the identification of specific defective elements.