Parallel MOSFET Power Converter for On-Die Thermal Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Power converters face challenges with thermal viability and increased board area requirements as power levels increase, necessitating the use of discrete MOSFETs externally, which complicates integration and increases power dissipation.
Innovation Solution
A power converter system with integrated switches and an external switch, controlled by a controller to minimize power dissipation, using a pseudo-static control scheme for the external switch to manage power flow efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If discrete MOSFETs are used externally for high power levels, then thermal viability is improved, but board area requirements increase and integration complexity increases
Solution Approach 1:
The patent divides the switching function into two segments: integrated switches (106a-106f) on the die handle low-to-medium power, and an external discrete MOSFET (116) handles high power. This segmentation allows each component to operate within its optimal power range, improving thermal viability while minimizing board area by only using the external component when necessary.
Solution Approach 2:
The system dynamically switches between using only integrated switches and using the external MOSFET in parallel, based on real-time power level detection. The controller (120) monitors power conditions and opportunistically activates the external switch to minimize power dissipation within the integrated circuit, adapting the configuration to current operational demands.
2Temperature
If discrete MOSFETs are used externally for high power levels, then thermal viability is improved, but device complexity increases
Solution Approach 1:
The patent merges the integrated switches and external discrete MOSFET into a unified power conversion system with coordinated control. The controller integrates both switching paths and manages their operation together, allowing the system to function as a single cohesive unit that leverages the advantages of both integrated and discrete components without proportionally increasing complexity.
Solution Approach 2:
The system includes automatic detection and control mechanisms that monitor power levels and autonomously determine when to activate the external MOSFET. This self-service approach minimizes manual configuration and control complexity, as the system automatically adapts its configuration based on real-time power conditions.
3Area of stationary object
If integrated switches are used for power conversion, then board area is minimized, but power dissipation within the integrated circuit increases at high power levels
Solution Approach 1:
The system uses the external MOSFET in parallel with integrated switches only when power levels exceed the optimal range for integrated components. This partial action approach allows integrated switches to handle normal power levels (minimizing board area) while the external component handles excessive power conditions (reducing power dissipation), applying the external resource only when necessary.
Solution Approach 2:
The system changes the operational parameters by switching between different configurations: using only integrated switches for low-to-medium power and transitioning to a parallel configuration with the external MOSFET for high power. This parameter change optimizes the balance between board area utilization and power dissipation management based on real-time power conditions.
Data Source
AI summary
A system may include a power converter comprising an integrated circuit comprising a plurality of integrated switches for the power converter and an external switch external to the integrated circuit and electrically coupled to a first integrated switch of the plurality of integrated switches. The system may also include a controller electrically coupled to the plurality of integrated switches and the external switch and configured to control the integrated switches and the external switch, including opportunistically controlling the external switch to minimize power dissipation within the integrated circuit during operation of the power converter.