Parallel Optical Module Layout for High-Density Thermal Control
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Solution Overview
Problem
Conventional optical communication modules face challenges in achieving high density and low power consumption while maintaining a small size, as they are restricted by standard specifications, limiting the number of optical communication units and efficient heat dissipation within a defined casing.
Innovation Solution
A multi-channel parallel optical communication module design with optical communication units disposed at the same level on a temperature controller, allowing for direct thermal contact and an airtight cavity to enhance space utilization, incorporating multiple optical communication units and a temperature controller for efficient heat dissipation, and using optical isolators and welding rings for secure optical fiber coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of optical communication units is increased to achieve higher bandwidth, then the communication capacity is improved, but the module size and power consumption increase
Solution Approach 1:
The patent transitions from vertical stacking to horizontal planar arrangement of optical communication units. Multiple optical units are disposed side-by-side at the same level on the circuit board, utilizing the horizontal plane dimension to accommodate more units without increasing the module's vertical height, thereby achieving higher bandwidth within the same form factor volume.
Solution Approach 2:
The patent combines multiple optical communication units and their corresponding temperature control structures into a single integrated module. The temperature controller is designed to simultaneously manage thermal conditions for multiple optical units through a unified thermal management system, reducing overall module complexity and power consumption while maintaining high communication capacity.
2Quantity of substance
If multiple optical communication units are packed into a small space, then the density is improved, but the heat dissipation becomes more difficult
Solution Approach 1:
The patent divides the thermal management system into multiple independent temperature controllers, each responsible for specific optical communication units. This segmentation allows for localized thermal control and dissipation, preventing heat accumulation in any single region while maintaining high density packing of optical units across the module.
Solution Approach 2:
The patent introduces temperature controllers as intermediary thermal management components between the optical communication units and the environment. These controllers actively regulate the temperature of each optical unit, facilitating efficient heat dissipation from the densely packed units without requiring increased physical spacing.
3Volume of moving object
If the module size is reduced to meet form factor requirements, then the integration density is improved, but the space for heat dissipation and component arrangement is limited
Solution Approach 1:
The patent extracts the temperature control functionality into separate, dedicated temperature controller components that are independently integrated with the optical units. This extraction allows for modular design where thermal management is handled by specialized components rather than being embedded within the optical units themselves, simplifying the overall component arrangement within the compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a high-density, low-power optical communication module with improved thermal management and reliability, accommodating more channels within a compact size while preventing environmental interference, thus meeting the demands of modern communication systems.
Implementation Method 1
optical communication units disposed at the same level on a temperature controller, allowing for direct thermal contact
Implementation Method 2
using optical isolators and welding rings for secure optical fiber coupling
Data Source
AI summary
A multi-channel parallel optical communication module includes a casing having an airtight cavity, an optical communication assembly accommodated in the airtight cavity, and a temperature controller in thermal contact with the optical communication assembly. The optical communication assembly includes a plurality of optical communication units disposed at same level, and a number of the plurality of optical communication units is greater than four.