Parallel Pair Cable Shield Adhesion Stability
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Solution Overview
Problem
Existing parallel pair cables experience unstable shield effects during differential signal transmission, leading to increased common mode output relative to differential mode input signals due to relative shifting of conductive shield tapes with respect to insulated electric wires.
Innovation Solution
Incorporating a drain wire inside or outside the shield tape with a metal layer, where the adhesion surface area of the adhesive applied to the metal layer is between 30% to 70% of the metal layer's surface area, ensuring stable electrical conduction and adherence of the shield tape to the insulated wires, thereby preventing relative shifting and stabilizing the shield effect.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is applied to the entire metal layer surface, then adhesion strength is improved, but electrical conduction between drain wire and metal layer deteriorates
Solution Approach 1:
The patent applies adhesive only to specific local areas of the metal layer surface rather than the entire surface. The adhesion surface is positioned at locations that do not interfere with the electrical contact between the drain wire and metal layer, creating different functional zones: one for adhesion and another for electrical conduction.
Solution Approach 2:
The metal layer surface is segmented into distinct functional areas: an adhesion surface for bonding the shield tape to insulated wires, and a contact surface for electrical connection with the drain wire. This segmentation allows each surface to perform its specific function without interfering with the other.
2Ease of manufacture
If shield tape is made loosely wrapped, then ease of manufacture is improved, but shield effect stability deteriorates
Solution Approach 1:
The shield tape is pre-applied with adhesive in specific patterns before wrapping around the insulated wires. This preliminary preparation allows the tape to be easily wrapped while ensuring that upon completion, the adhesive creates stable bonding at critical locations to prevent relative shifting and maintain shield effect stability.
3Strength
If adhesion surface area is increased, then adherence between shield tape and insulated wires is improved, but electrical conduction area is reduced
Solution Approach 1:
The patent creates distinct local zones on the metal layer: an adhesion surface with sufficient area for strong bonding to insulated wires, and a separate contact surface area for electrical conduction with the drain wire. The adhesion surface area is optimized to provide adequate bonding strength without encroaching on the electrical contact zone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the common mode output relative to differential mode input signals by ensuring secure electrical conduction and adherence, maintaining a stable shield effect during differential signal transmission.
Implementation Method 1
a surface of the metal layer is provided with an adhesion surface having an adhesive applied thereto, wherein the adhesion surface and the pair of insulated electric wires are adhered to each other
Implementation Method 2
the drain wire is provided to electrically contact the metal layer
Data Source
AI summary
A parallel pair cable includes a pair of insulated electric wires aligned in parallel, a shield tape longitudinally wrapped around the pair of insulated electric wires, a drain wire disposed inside the shield tape, and an insulating tape wrapped on an outer side of the shield tape. The shield tape has a metal layer provided on an inner surface thereof. The drain wire is provided to electrically contact the metal layer. A surface of the metal layer is provided with an adhesion surface having an adhesive applied thereto. The adhesion surface and the pair of insulated electric wires are adhered to each other. An area of the adhesion surface is 30% to 70% of a surface area of the metal layer.