Parallel PCB Test Carrier With Movable Electrical Contacts
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Solution Overview
Problem
The increasing complexity and miniaturization of electronic assemblies, such as printed circuit boards (PCBs), particularly in smartphones and other portable devices, have made traditional panel-based testing inefficient, as it requires testing individual PCBs sequentially, which is time-consuming and not suited for the stringent testing requirements of smaller components.
Innovation Solution
A system that uses carriers with movable parts to enable parallel testing of PCBs, incorporating features like thermally conductive objects, RF shielding, and automated mechanisms for efficient electrical and thermal management, allowing for asynchronous testing and improved testing throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional panel-based testing is used for PCBs, then testing can be performed with simple equipment, but testing must be done sequentially which reduces productivity
Solution Approach 1:
The test system is divided into multiple independent test slots, each capable of testing a PCB separately. This segmentation allows parallel testing of multiple PCBs simultaneously, dramatically improving productivity from sequential to parallel processing while distributing system complexity across modular units.
Solution Approach 2:
The system transitions from one-dimensional sequential testing to multi-dimensional parallel testing by adding spatial dimensionality with multiple test slots operating simultaneously. This dimensional expansion enables throughput scaling without proportionally increasing per-unit complexity.
2Volume of moving object
If PCB size is reduced for portable devices, then device portability is improved, but testing becomes more difficult due to smaller contact areas and stricter requirements
Solution Approach 1:
The carrier structure incorporates localized features such as precisely positioned contact pads, alignment marks, and support points that match the specific geometry of small PCBs. This local adaptation enables accurate electrical contact and positioning despite the reduced overall PCB size and stricter tolerances.
Solution Approach 2:
The carrier acts as an intermediary between the small PCB and the test system. It provides enlarged contact interfaces, precision positioning mechanisms, and protective structures that make handling and testing of miniaturized PCBs feasible, effectively mediating the size mismatch between the small device and the testing equipment.
3Productivity
If multiple PCBs are tested in parallel, then productivity increases, but thermal management becomes more challenging due to localized heat sources
Solution Approach 1:
The carrier structure extracts and isolates heat-generating components by providing dedicated thermal management features such as heat sinks, thermal vias, and airflow channels positioned at specific locations corresponding to localized heat sources on each PCB, preventing heat accumulation during parallel testing.
Solution Approach 2:
The carrier incorporates thin thermally conductive structures and flexible thermal management layers that can adapt to the specific thermal profiles of different PCBs being tested in parallel, providing customized heat dissipation paths for each device while maintaining overall system compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables faster, more efficient, and more comprehensive testing of smaller PCBs by allowing parallel processing, improved thermal management, and adherence to stringent testing requirements, enhancing the overall testing efficiency and accuracy.
Implementation Method 1
At least one of the first part and the second part may comprise thermally-conductive objects at locations corresponding to the localized heat sources, where the thermally-conductive objects are used to conduct, convect, or radiate heat from the localized heat sources.
Implementation Method 2
Each slot may comprise an air mover for blowing air through the slot and through air pathways in a carrier in the slot. The air may be below 25° C. or above 25° C.
Implementation Method 3
The carrier may comprise circuitry configured to emulate a power source that is usable in a product for which the EA is intended. Each carrier may comprise one or more air pathways, through which air is able to flow through the carrier.
Data Source
AI summary
An example system for testing electronic assemblies (EAs) may include carriers for holding EAs and slots for testing at least some of the EAs in parallel. Each slot may be configured to receive a corresponding carrier containing an EA and to test the EA. An example carrier in the system may include a first part and a second part. At least one of the first part and the second part include a first structure, and the first structure is movable to enable electrical connection between an EA and an electrical connector.