Parallel Reflow Furnace Layout for Independent PCB Soldering
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Solution Overview
Problem
Reflow devices with multiple transfer means and zones face issues when one side is opened, requiring shutdown of others to prevent temperature interference and exposure to outside air, disrupting the temperature profiles and operational efficiency.
Innovation Solution
A soldering apparatus with separate opening/closing mechanisms for each reflow furnace main body, using multistage cylinders and heat-insulating members to maintain independent temperature profiles and prevent exposure, allowing for simultaneous operation of multiple transfer means.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple transfer means are arranged in parallel in a single reflow furnace main body, then productivity is improved, but when one side is opened for maintenance the other sides must be shut down causing temperature instability
Solution Approach 1:
The reflow furnace is divided into multiple independent reflow furnace main bodies (first reflow furnace main body and second reflow furnace main body), each capable of independent operation with separate opening/closing mechanisms. This segmentation allows one furnace to be opened for maintenance while the other continues operating, maintaining temperature profile stability and productivity simultaneously.
2Ease of repair
If the reflow furnace main body is opened for maintenance, then ease of repair is improved, but the inside is exposed to outside air causing temperature changes and requiring shutdown of other transfer means
Solution Approach 1:
Each reflow furnace main body has its own separate opening/closing means (first opening/closing means and second opening/closing means), allowing independent access for maintenance without affecting other furnaces. This enables repair access while maintaining temperature stability in operating furnaces.
Solution Approach 2:
The opening/closing means include movable lids or covers that can be opened for maintenance and closed to seal the furnace interior, preventing outside air exposure and maintaining temperature stability when closed.
3Reliability
If separate opening/closing means are provided for each reflow furnace main body, then reliability is improved by preventing exposure, but device complexity increases
Solution Approach 1:
The furnace system is segmented into independent units, each with its own opening/closing mechanism. While this increases the number of components, it enables independent operation and maintenance, improving reliability by preventing temperature profile disruption in operating furnaces when others are being serviced.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables independent temperature control and operation of multiple transfer means without temperature interference, even when one reflow furnace is opened, enhancing efficiency and maintaining set profiles.
Implementation Method 1
the first opening/closing means includes cylinders as first lifting/lowering means for lifting/lowering the upper main body of the first reflow furnace main body vertically, without being rotated relative to the lower main body of the first reflow furnace main body
Data Source
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AI summary
In a soldering apparatus in which transfer means are arranged in parallel, even when the one transfer means side of a reflow furnace main body is opened, the inside of the reflow furnace main body on the other transfer means side is not exposed. A soldering apparatus 100 includes transfer rails 13A as a first transfer means for transferring a printed circuit board PI, transfer rails 13B as a second transfer means provided in parallel to a transfer direction of the printed circuit board P1 to be transferred by the transfer rails 13A, a muffle 20A as a first reflow furnace main body for heating the printed circuit board P1 transferred by the transfer rails 13A, a muffle 20B as a second reflow furnace main body for heating a printed circuit board P2 transferred by the transfer rails 13B, and a main frame 10 as a frame for housing the muffle 20A and the muffle 20B. The main frame 10 includes an opening/closing part 30A as a first opening/closing means for opening/closing the muffle 20A, and an opening/closing part 30B as a second opening/closing means for opening/closing the muffle 20B.