Parallel refrigerant cooling in datacenter cooling systems

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing datacenter cooling systems face challenges in efficiently addressing varying cooling requirements and ensuring uniform cooling across multiple computing devices, particularly in high heat density environments, due to issues with series cooling methods that prioritize one device over others and inadequate control of two-phase refrigerant flow in cold plates.

Innovation Solution

Implementing a parallel refrigerant cooling system with flow controllers to distribute equal measures of liquid and vapor phases of refrigerant across multiple paths, ensuring uniform cooling by maintaining equal liquid phase values in each path, and using flow equalization to optimize two-phase refrigerant flow in cold plates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If series cooling methods are used to cool multiple computing devices, then one device can be cooled effectively, but other devices receive insufficient cooling and hot spots develop

Engineering Contradiction:
Improvecooling effectivenessVSAvoiduniform cooling distribution
Core Design Contradiction:
TemperatureVSEase of operation

Solution Approach 1:

The cooling system is divided into multiple parallel cooling paths, each independently cooling a specific computing device. Instead of using a single series cooling path that cools devices sequentially, the system segments the cooling flow into parallel branches, allowing simultaneous cooling of multiple devices with equal effectiveness.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system transitions from a one-dimensional series cooling arrangement to a multi-dimensional parallel cooling architecture. By adding the dimension of parallelism, the system can address multiple cooling requirements simultaneously rather than sequentially, eliminating hot spots and ensuring uniform cooling distribution across all devices.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Power

If two-phase refrigerant flow is used in cold plates, then cooling capacity is increased, but flow distribution becomes uneven and control becomes difficult

Engineering Contradiction:
Improvecooling capacityVSAvoidflow control complexity
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The system carefully controls and adjusts the parameters of two-phase refrigerant flow, including pressure, temperature, and phase composition, to optimize cooling capacity while maintaining stable and uniform flow distribution across parallel paths. By precisely managing these parameters, the system achieves high cooling power without the flow distribution and control problems that typically accompany two-phase flow.

Inventive Principle:
Principle #35Parameter changes

3Ease of operation

If parallel refrigerant paths are implemented, then uniform cooling is achieved across multiple devices, but system complexity increases

Engineering Contradiction:
Improveuniform cooling distributionVSAvoidsystem structure
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The cooling system is segmented into multiple parallel paths with independent flow control, allowing uniform cooling distribution across multiple devices. Each path is a simplified independent unit that can be easily controlled and maintained, offsetting the apparent structural complexity through modular design.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables efficient and uniform cooling of high heat density computing components by ensuring all devices receive equal cooling capacity, addressing hot spots and optimizing heat removal, even in dynamic conditions.

Implementation Method 1

distribute equal measures of a liquid phase, relative to a vapor phase, of a refrigerant to multiple parallel refrigerant paths

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 2

cooling systems may include a chiller within the datacenter area, which may include area external to the datacenter itself

Methodology Applied
Scientific EffectHeat absorption during phase change: Latent Heat

Implementation Method 3

cold plates...optimizing heat removal

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 4

external heat exchanger that receives heated coolant from the datacenter and that disperses the heat

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Implementation Method 5

distribute equal measures of a liquid phase, relative to a vapor phase, of a refrigerant to multiple parallel refrigerant paths

Methodology Applied
Scientific EffectFluid flow: Two-Phase Flow

Data Source

PatentUS20250240933A1Parallel refrigerant cooling in datacenter cooling systems
Publication Date: 2025.07.24 NVIDIA CORP
  • US20250240933A1 patent drawing
  • US20250240933A1 patent drawing
  • US20250240933A1 patent drawing

AI summary

Systems and methods for cooling a datacenter are disclosed. A datacenter cooling system includes one or more flow controllers to distribute equal ratios of a liquid phase of refrigerant relative to a vapor phase of refrigerant to cold plates along a plurality of parallel refrigerant paths.