Parallel Resin Deposition and Imprinting for Nanoimprint Throughput
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Solution Overview
Problem
Current nanoimprinting technologies for semiconductor manufacturing face challenges in throughput due to the time-consuming processes of pressing the mold onto the resin and depositing resin, which hinder efficient transfer of microstructures onto substrates.
Innovation Solution
An imprinting apparatus and method that perform resin deposition and mold imprinting processes in parallel, utilizing a deposition mechanism, driving mechanisms, and a control unit to synchronize and optimize the positioning of the mold, substrate, and resin deposition unit for simultaneous resin deposition and pattern transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the mold pressing process is performed sequentially after resin deposition, then the pattern transfer accuracy is maintained, but the processing time increases significantly
Solution Approach 1:
The resin deposition process is performed in advance before the mold pressing process. The resin layer is deposited on the substrate, then the mold is pressed onto the resin to transfer the pattern. This preliminary action of depositing resin before pressing allows the subsequent pressing operation to be performed efficiently without time loss, as the resin is already in position and ready for immediate pattern transfer.
Solution Approach 2:
The resin deposition and mold pressing operations are designed to continue without unnecessary interruptions. The deposition mechanism deposits resin continuously or in rapid succession, and immediately follows with the mold pressing operation. This continuity eliminates idle time between operations while maintaining pattern transfer accuracy, as the resin layer is prepared and then immediately used for pattern transfer without delay.
2Manufacturing precision
If the resin deposition is performed by drop-on-demand method, then the resin layer thickness uniformity is improved, but the throughput decreases
Solution Approach 1:
The resin deposition is performed as a preliminary action before the mold pressing operation. By depositing the resin layer in advance using the drop-on-demand method, the system achieves uniform thickness control. Once deposited, the resin layer is immediately ready for the subsequent mold pressing operation, eliminating the need to wait for deposition during the pressing process, thus maintaining high throughput.
Solution Approach 2:
The resin deposition process is segmented into discrete, controlled drops placed at specific locations. The drop-on-demand method deposits resin in separate, controlled units rather than continuous flow, allowing precise control over each drop's position and volume. This segmentation enables uniform thickness across the resin layer while maintaining rapid deposition speed, as each drop can be placed quickly and precisely without requiring slow, continuous deposition.
3Productivity
If two substrate stages are used for parallel processing, then the throughput is increased, but the manufacturing cost increases
Solution Approach 1:
A single substrate stage is designed to perform multiple functions: it supports the substrate during resin deposition, maintains positioning during mold pressing, and facilitates the entire parallel processing sequence. The substrate stage is a universal platform that handles all operations (deposition and pressing) without requiring separate dedicated stages for each function, thereby avoiding the high cost of multiple specialized stages while still enabling parallel processing and high throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases throughput by allowing the resin deposition and imprinting processes to occur concurrently, reducing overall processing time and improving the efficiency of microstructure transfer onto substrates.
Implementation Method 1
a deposition mechanism configured to deposit the resin onto the substrate
Implementation Method 2
a control unit configured to control the deposition mechanism and the driving mechanism so as to perform a resin deposition process of depositing the resin onto the substrate and an imprint process of transferring the pattern of the mold to the resin on the substrate in parallel
Data Source
AI summary
There is provided an imprinting apparatus that transfers a pattern of a mold to a resin on a substrate, the imprinting apparatus including a deposition mechanism configured to deposit the resin onto the substrate; a first driving mechanism configured to change a relative position, on a plane parallel to the surface of the substrate, of the substrate and the mold; a second driving mechanism configured to change the relative position, on a plane parallel to the surface of the substrate, of the substrate and the deposition mechanism; and a control unit configured to control the deposition mechanism and the driving mechanism so as to perform a resin deposition process of depositing the resin onto the substrate and an imprint process of transferring the pattern of the mold to the resin on the substrate in parallel.