Parallel Resistive Network for Ambient Temperature Calculation
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Solution Overview
Problem
Current electronic devices without active cooling solutions rely on internal temperature monitoring and do not account for environmental conditions, making it difficult to effectively manage heat dissipation as they often require external data for ambient temperature, limiting their operational efficiency.
Innovation Solution
A method and system using a parallel resistive network within the device to measure internal and external temperatures, calculating the ambient temperature and effective heat transfer coefficient independently, allowing for autonomous thermal management adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If passive cooling with internal temperature monitoring is used, then device size constraints are met, but thermal management effectiveness deteriorates due to lack of environmental condition accounting
Solution Approach 1:
The device uses its own internal components (processor, memory, parallel resistive network) to simultaneously perform computation and environmental sensing. The processor generates heat that is measured by the parallel resistive network, allowing the device to self-determine ambient temperature without external sensors or secondary devices.
Solution Approach 2:
The parallel resistive network serves multiple functions: it acts as a thermal management component for heat dissipation monitoring and simultaneously serves as an ambient temperature sensing mechanism. This multi-functionality eliminates the need for separate sensing components, maintaining compact device size while improving thermal management.
2Device complexity
If internal temperature monitoring only is used, then device complexity is minimized, but measurement precision deteriorates because ambient temperature cannot be determined
Solution Approach 1:
The parallel resistive network acts as an intermediary between the processor's heat generation and the ambient environment. By measuring the temperature differential across the resistive paths and using pre-established resistive properties, the system calculates ambient temperature indirectly through the relationship between internal heat, thermal resistance, and environmental conditions.
Solution Approach 2:
The system changes the measurement parameter from direct ambient temperature sensing to indirect calculation based on temperature differential and resistive properties. By measuring internal temperature at multiple locations and applying thermal resistance relationships, the system derives ambient temperature with improved precision without adding complex sensing hardware.
3Measurement precision
If external ambient temperature data is used, then measurement precision improves, but device independence deteriorates due to reliance on secondary devices
Solution Approach 1:
The device independently determines ambient temperature using its own internal components and measurements. The parallel resistive network, in conjunction with internal temperature sensors and pre-stored resistive properties, enables the device to self-calculate ambient temperature without requiring data from external sources, secondary devices, or remote computers.
Solution Approach 2:
The system continuously monitors internal temperature at multiple locations and uses this feedback, combined with known resistive properties, to calculate and adjust the ambient temperature determination. This closed-loop approach allows the device to adapt to changing environmental conditions independently and maintain accurate thermal management.
4Temperature
If processor frequency throttling is used, then temperature control is achieved, but productivity deteriorates due to operational limitations
Solution Approach 1:
The thermal management system dynamically adjusts device operation based on real-time ambient temperature determination and internal temperature monitoring. Rather than applying static frequency throttling, the system can adaptively modify processing frequency, power consumption, and thermal dissipation strategies according to the calculated ambient conditions and effective heat transfer coefficient, optimizing both temperature control and productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient heat dissipation and thermal management by calculating ambient temperature and heat transfer coefficient, optimizing device performance and power consumption based on environmental conditions without external data, enhancing operational efficiency and temperature regulation.
Implementation Method 1
measuring a first temperature at a first location along a first resistive path of a parallel resistive network and measuring a second temperature at a second location along a second resistive path of the parallel resistive network
Data Source
AI summary
A method, a system, and computer program product for calculating an effective heat transfer coefficient of a device. The method includes measuring: an internal temperature of the device, a first temperature at a first location along a first resistive path of a parallel resistive network and a second temperature at a second location along a second resistive path of the parallel resistive network. An ambient temperature of the environment and an effective heat transfer coefficient of the device is then calculated based on the internal temperature, the first temperature, the second temperature, and resistive properties of the parallel resistive network. The ambient temperature and the effective heat transfer coefficient are provided to a thermal management component.