Parallel Seam Welding Leadless Ceramic Package for RF Reliability
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Solution Overview
Problem
Traditional ceramic quad flat non-leaded packages for MMICs face challenges in covering the X-band frequency range with poor RF performance, high sealing complexity and cost, and limited heat dissipation, which hinders the development of high-power microwave RF systems.
Innovation Solution
A parallel seam welding leadless ceramic package with a ceramic structure featuring multiple layers for RF signal transmission and grounding, sealed by a metal cover plate using a parallel seam welding process, optimizing the layout for improved RF performance and sealing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional alloy solder seal method is used for narrow ceramic wall packaging, then sealing can be achieved, but the sealing process becomes complicated and cost increases
Solution Approach 1:
The patent changes the wall thickness parameter of the ceramic package from narrow to thick (at least 0.6mm), which enables the use of parallel seam welding method instead of the complicated alloy solder seal method, thereby simplifying the sealing process while maintaining high sealing reliability
Solution Approach 2:
The patent replaces the alloy solder seal method with parallel seam welding method, substituting a complicated mechanical sealing process with a simpler welding process that is more suitable for automated production and reduces manufacturing complexity
2Reliability
If traditional ceramic quad flat non-leaded package structure is used, then basic protection is provided, but RF performance deteriorates rapidly with frequency and X-band coverage is insufficient
Solution Approach 1:
The patent transitions from a traditional two-layer ceramic structure to a three-layer structure with gradually decreasing height from outside to inside, creating additional spatial dimensions for optimized RF signal transmission and improved frequency coverage including Ku-band
Solution Approach 2:
The patent implements localized grounding structures with grounding lines on both first and second layers, and grounding metal patterns on the third layer, creating optimized local electromagnetic environments that improve overall RF performance and eliminate in-band resonance points across wider frequency ranges
3Reliability
If complex alloy solder seal method is used, then sealing can be achieved, but production efficiency decreases and cost increases
Solution Approach 1:
The patent replaces the multi-step alloy solder seal process with a single-step parallel seam welding process, which can be performed continuously and is more suitable for automated production lines, thereby significantly improving production efficiency while maintaining high sealing quality
Solution Approach 2:
The patent extracts and eliminates the intermediate alloy solder material from the sealing process, directly welding the metal cover plate to the ceramic body through parallel seams, which simplifies the process steps and improves manufacturing efficiency
Data Source
AI summary
The application discloses a parallel seam welding leadless ceramic package, including a ceramic, a sealing ring and a metal cover plate; a back surface of the ceramic is provided with a back grounding metal pattern, and the back grounding metal pattern is provided with several outwardly protruding grounding terminals, a RF signal transmission pad is disposed between every two adjacent grounding terminals, the front grounding metal pattern and the back grounding metal pattern are interconnected by the internal and/or external metallized interconnection holes, the front grounding line and the back grounding metal pattern is interconnected by the internal or external metallized interconnection holes, and the RF signal transmission lines are interconnected to the RF signal transmission pad by a separated external and/or external metallized interconnection hole.