Parallel Semiconductor Switching Devices on Common Heat Sinks

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Solution Overview

Problem

Existing dynamo-electric machines for vehicles lack flexibility in design, leading to inefficiencies in power generation and driving, reliability issues, and increased costs due to the use of single semiconductor switching devices, which limits high-power achievement and complicates cooling and heat management.

Innovation Solution

A control device integrated dynamo-electric machine with an inverter bridge featuring multiple semiconductor switching elements arranged in parallel, mounted to common heat sinks for improved reliability, cost performance, and cooling properties, allowing for effective heat dissipation and flexible design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple semiconductor switching devices are arranged in parallel, then reliability is improved and cost is reduced, but device complexity increases

Engineering Contradiction:
ImprovereliabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The inverter bridge is segmented into multiple independent semiconductor switching devices arranged in parallel within each arm. Each device can operate independently, and if one fails, the others can continue to function, thereby improving system reliability while maintaining a manageable structural complexity through modular organization.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements redundant semiconductor switching devices in parallel configuration before failure occurs. This beforehand cushioning ensures that if one device fails, the system has pre-prepared backup devices to take over, maintaining continuous operation and improving reliability without requiring complex real-time failure detection and replacement mechanisms.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Temperature

If multiple semiconductor switching devices are arranged in parallel, then cooling efficiency is improved, but heat sink complexity increases

Engineering Contradiction:
Improvecooling efficiencyVSAvoidheat sink complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

Multiple semiconductor switching devices are merged onto a common heat sink structure. The heat sink consolidates the thermal management function for all parallel devices, improving cooling efficiency by providing a unified thermal pathway while avoiding the complexity of multiple separate heat sinks. The common heat sink serves all devices simultaneously, reducing overall system complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The common heat sink performs multiple functions: it cools all semiconductor switching devices in parallel, provides a unified mounting structure, and serves as a thermal management system for the entire inverter bridge. This multi-functionality improves cooling efficiency while reducing the number of separate cooling components needed.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The parallel arrangement of semiconductor switching devices enhances reliability, reduces costs, and improves cooling efficiency, enabling continued operation even with failed devices and supporting high-power applications while maintaining thermal safety.

Implementation Method 1

a plurality of heat sinks that are provided for respective arms of the inverter bridge and include the semiconductor switching elements mounted thereto for cooling the semiconductor switching elements mounted thereto

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS7589481B2Control device integrated dynamo-electric machine
Publication Date: 2009.09.15 MITSUBISHI ELECTRIC MOBILITY CORP
  • US7589481B2 patent drawing
  • US7589481B2 patent drawing
  • US7589481B2 patent drawing

AI summary

In order to improve reliability, cost performance, and cooling property, a control device integrated dynamo-electric machine mounted to a dynamo-electric machine includes an inverter bridge configured with a plurality of semiconductor switching elements, and a plurality of heat sinks provided for respective arms of the inverter bridge and having the semiconductor switching elements of the corresponding arms mounted thereon for cooling the mounted semiconductor switching elements, wherein the semiconductor switching element includes a plurality of semiconductor switching devices arranged in parallel, and the plurality of semiconductor switching devices arranged in parallel are mounted on the common heat sinks.