Parallel Sensor Array for Multi-Band Electronic Circuit Inspection
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Solution Overview
Problem
Scanning electronic circuits using multiple cameras and lighting systems is a slow and costly process due to the need for acquiring multiple images with different filters and lighting conditions to detect various defects.
Innovation Solution
An inspection system employing two groups of sensors, one for detecting light components of a first band (e.g., red or infrared) and another for a second band (e.g., green or visible light), which operate in parallel to generate detection signals, processed by a unit to detect defects in metal components and solder masks simultaneously.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple cameras and lighting systems are used to detect different types of defects with different filters, then defect detection capability is improved, but scanning speed deteriorates and cost increases
Solution Approach 1:
The patent combines multiple sensor groups (first group for first light band, second group for second light band) into a single integrated sensor array that captures multiple light bands simultaneously. This merging eliminates the need for sequential imaging with multiple cameras, thereby maintaining comprehensive defect detection capability while significantly improving scanning speed by capturing all light band information in parallel during a single scan pass.
2Adaptability or versatility
If multiple cameras and lighting systems are used to acquire images with different filters, then defect detection capability is improved, but system cost increases
Solution Approach 1:
The patent merges multiple sensor groups into a single integrated sensor array structure, reducing the number of separate camera systems and lighting components required. This consolidation maintains the ability to detect different defect types through multiple light bands while significantly reducing system complexity and associated costs.
Solution Approach 2:
The integrated sensor array is designed to perform multiple functions simultaneously - detecting different light bands (first and second bands) and identifying various defect types (metal component defects, solder mask defects) within a single system. This multi-functionality eliminates the need for separate specialized cameras for each defect type, thereby reducing overall system cost while maintaining comprehensive detection capability.
3Measurement precision
If sequential imaging with different filters is used, then defect detection accuracy is improved, but inspection time increases
Solution Approach 1:
The patent combines multiple sensor groups that detect different light bands into a single integrated array, enabling simultaneous capture of first and second light band information during one imaging operation. This eliminates the sequential imaging process, maintaining high defect detection accuracy through multi-band analysis while reducing inspection time by capturing all necessary data in parallel during a single scan.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly speeds up the defect detection process while reducing costs by enabling parallel signal processing and simultaneous detection of different types of defects in electronic circuits, such as printed circuit boards, without the need for multiple cameras and lighting systems.
Implementation Method 1
a first group of sensors, for sensing light components of a first light band of an image of an area of an inspected object, and for generating first detection signals reflecting sensed light components of the first light band
Implementation Method 2
a second group of sensors, for sensing light components of a second light band of the image of the area of the inspected object, wherein the second light band differs from the first light band, and for generating second detection signals reflecting sensed light components of the second light band
Implementation Method 3
optics, for projecting the image of the area of the inspected object towards the first group of sensors and towards the second array of sensors
Data Source
AI summary
An inspection method and an inspection system, the inspection system includes: (i) a first group of sensors, for sensing light components of a first light band of an image of an area of an inspected object, and for generating first detection signals reflecting sensed light components of the first light band; (ii) a second group of sensors, for sensing light components of a second light band of the image of the area of the inspected object, wherein the second light band differs from the first light band, and for generating second detection signals reflecting sensed light components of the second light band; (iii) optics, for projecting the image of the area of the inspected object towards the first group of sensors and towards the second array of sensors; and (iv) a processing unit, coupled to the first and second group of sensors, for detecting defects based on the first or second detection signals.