Parallel Sensor Stage Temperature Circuit for Lower Scrap
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Solution Overview
Problem
Conventional temperature sensor technologies face challenges in cost-effective production, high material and energy consumption, and inefficiencies in soldering processes, leading to high scrap rates, increased space consumption, and higher power requirements due to unbalanced load distribution in series and parallel connections.
Innovation Solution
A temperature controller circuit with parallel-connected sensor stages and individual sensor element controllers, allowing for reduced operation voltage, balanced load distribution, and reduced scrap rates, while enabling precise temperature measurement and detection of improper assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If sensor stages are connected in series, then power requirements are reduced, but scrap rate increases due to interruptions in chip assembly
Solution Approach 1:
The temperature sensor device is divided into multiple independent sensor stages connected in parallel, each with its own sensor element and controller. This segmentation allows individual stages to be tested and replaced without affecting the entire device, thereby reducing scrap rate while maintaining power efficiency through parallel architecture.
Solution Approach 2:
The patent changes the connection configuration from series to parallel, which fundamentally alters the electrical parameters of the device. This parameter change enables independent operation of each sensor stage, allowing for better fault isolation and reduced scrap rates while managing power consumption through controlled parallel connection.
2Loss of substance
If sensor stages are connected in parallel, then scrap rate is reduced, but power source requirements increase
Solution Approach 1:
Each sensor stage is equipped with its own dedicated controller that optimizes power distribution to that specific stage. This local quality approach ensures that power is efficiently allocated only where needed, reducing overall power source requirements while maintaining the benefits of parallel connection for scrap rate reduction.
Solution Approach 2:
The parallel connection architecture with individual controllers enables feedback mechanisms to monitor and adjust power consumption of each sensor stage. This feedback system allows dynamic power management that reduces overall power requirements while preserving the scrap rate benefits of parallel configuration.
3Ease of manufacture
If conventional soldering technologies are used, then manufacturing is simplified, but temperature exposure and flux deposition increase
Solution Approach 1:
The patent replaces conventional thermal field-based soldering processes with a controlled electrical heating approach using dedicated heaters for each sensor element. This substitution allows precise temperature control without the need for high-temperature flux-based soldering, thereby reducing temperature exposure and flux deposition while maintaining manufacturing feasibility.
4Adaptability or versatility
If high voltages are used in conventional circuits, then functionality is achieved, but space consumption increases due to Faraday cage requirements
Solution Approach 1:
The patent fundamentally changes the voltage parameter by operating sensor stages in parallel with lower individual voltages rather than using high voltages in series configurations. This parameter change eliminates the need for Faraday cages and high-voltage protection circuits, thereby significantly reducing space consumption while maintaining full circuit functionality through controlled parallel operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces scrap rates by 2-10%, minimizes space consumption, lowers manufacturing costs, and enhances reliability by ensuring balanced load distribution and precise temperature sensing.
Implementation Method 1
Manufacturing of chips, e.g. NTC, PTC, or any passive components may require heat treatment (e.g. soldering, coating, aging). This heating can be generated by applying electrical power (P=V*I=I{circumflex over ( )}2*R) to a sensor element also known as Joule heating.
Implementation Method 2
the temperature of the element is a function of the applied power and a dissipation factor associated with heat conduction towards an environment of the sensor element and proportional to the required energy or power to increase the body temperature of the chip by 1 Kelvin
Implementation Method 3
it is also possible to sense the chip's temperature by measuring the resistance during the heating process
Data Source
AI summary
In an embodiment a temperature controller circuit includes an evaluation circuit and two or more sensor stages, wherein each sensor stage includes a sensor element and a sensor element controller and wherein the sensor stages are electrically connected in parallel.