Parallel Temperature Sensor Circuit for Semiconductor Overload Detection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor arrangements with multiple semiconductor bodies in a common housing face challenges in efficiently and precisely detecting overload conditions without excessive space or cost, whether by individual temperature sensors per body or indirect, less precise measurements.
Innovation Solution
Integrate multiple temperature sensors, each connected in parallel between common housing pins, using diodes or similar elements with super-linear temperature dependencies, to accurately detect overload conditions through voltage measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor is placed in each semiconductor body, then measurement precision is improved, but device complexity increases due to requiring separate monitoring pins for each sensor
Solution Approach 1:
Multiple temperature sensors are electrically connected in parallel between common first and second pins, merging their output connections. This allows all sensors to share the same pin pair, eliminating the need for separate monitoring pins for each sensor while maintaining individual temperature measurement capability through parallel connection topology
Solution Approach 2:
The common first and second pins serve multiple functions: they are shared by all temperature sensors for temperature monitoring, and can also serve as power or signal pins for the semiconductor devices. This multi-functionality reduces the overall pin count required in the housing
2Device complexity
If indirect temperature measurement is used through other semiconductor bodies, then device complexity is reduced, but measurement precision deteriorates
Solution Approach 1:
Multiple temperature sensors are integrated directly into different semiconductor bodies and connected in parallel, combining the benefits of direct measurement (high precision) with shared pin connections (low complexity). Each sensor remains in its respective semiconductor body for accurate local temperature detection while sharing common pins
3Measurement precision
If individual monitoring pins are provided for each temperature sensor, then measurement precision is improved, but manufacturing cost increases
Solution Approach 1:
The parallel connection architecture merges multiple sensor outputs into common pins, reducing the number of monitoring pins required. This directly lowers manufacturing costs by reducing pin count, while the parallel connection topology preserves the ability to individually monitor each sensor's temperature data through the shared pins
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows precise overload detection with reduced pin count and lower error rates compared to conventional methods, enhancing reliability and efficiency.
Implementation Method 1
using diodes or similar elements with super-linear temperature dependencies
Data Source
Figure 1~4B
Figure 5~6
Figure 7~8
AI summary
A semiconductor arrangement and a method for operating a semiconductor arrangement are disclosed. The semiconductor arrangement includes: a plurality of semiconductor bodies (11, 12, 1n); a housing (3) in which the plurality of semiconductor bodies (11, 12) are arranged; and a sensor circuit (2) including a plurality of temperature sensors (21, 22, 2m),. In each of the semiconductor bodies (11, 12, 1n) at least one of the temperature sensors (21, 22, 2m) is integrated. Furthermore, each of the temperature sensors (21, 22, 2m) is connected between a first pin (31) and a second pin (32) of the housing (3).