Parallel Solder Ball Sets for High-Speed Differential Signal Transmission
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Solution Overview
Problem
Current semiconductor devices face challenges in achieving high-speed operation due to limitations in signal transmission and reception capacity, as well as heat management, which affects the reliability and efficiency of semiconductor memory chips.
Innovation Solution
The semiconductor package design incorporates multiple solder ball sets arranged in parallel to enhance signal transmission capacity and reduce wiring length, along with a thermal management system using thermal balls to effectively dissipate heat, ensuring efficient operation and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple solder ball sets are arranged in parallel to enhance signal transmission capacity, then data transmission and reception capacity is improved, but device complexity increases
Solution Approach 1:
The patent divides the signal transmission interface into multiple solder ball sets, where each set independently handles differential input and output signals. This segmentation allows parallel data transmission channels to be established, doubling the data transmission and reception capacity while maintaining manageable complexity through modular organization of signal paths
Solution Approach 2:
The patent transitions from a single-channel signal transmission approach to a multi-channel parallel architecture by adding spatial dimensionality through multiple solder ball sets arranged in parallel. This dimensional expansion enables simultaneous data transmission across multiple channels, significantly increasing throughput capacity
2Speed
If solder ball sets are arranged to reduce wiring length, then signal transmission speed is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies local quality optimization by carefully positioning solder balls within each set to minimize wiring length for high-speed differential signals. Each solder ball location is precisely determined to achieve optimal signal transmission characteristics locally, while the overall arrangement maintains manufacturability through standardized pitch dimensions
Solution Approach 2:
The patent optimizes signal transmission speed by changing the physical parameters of the solder ball arrangement, specifically reducing wiring length and optimizing trace routing. These parameter changes are balanced against manufacturing capabilities by maintaining standard pitch values that are achievable with conventional PCB fabrication processes
3Reliability
If thermal management system is implemented to dissipate heat, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent merges thermal management functionality with the existing solder ball structure by implementing thermal balls that serve dual purposes: electrical connection for signal transmission and thermal conduction for heat dissipation. This integration allows heat to be effectively conducted away from the semiconductor memory chips through the thermal balls without requiring separate thermal management components, thus improving reliability while minimizing additional complexity
Data Source
AI summary
According to one embodiment, a semiconductor device includes a board, a sealing portion, a controller, a semiconductor chip, and solder balls. The board includes a first surface and a second surface opposite to the first surface. The controller and the semiconductor chip are covered with the sealing portion. The solder balls are on the second surface of the board. The solder balls include a plurality of solder ball sets each corresponding to a pair of differential input and differential output signals, and the plurality of solder ball sets are arranged substantially parallel to a side of the board.