Parallel Stacking Mid-Frame Supports for Thin Portable Devices
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Solution Overview
Problem
The challenge in designing portable electronic devices is to achieve a smaller profile while maintaining structural rigidity, as thinning materials for smaller devices lead to reduced torsional and flexural rigidity, and existing mid-frame structural supports may not adequately address this issue without increasing thickness.
Innovation Solution
The implementation of parallel stacking mid-frame structural supports with side members configured to provide structural support when a load exceeds a predetermined threshold, including rib supports for a printed circuit board, which are disposed perpendicular and parallel to each other to define openings around electronic components, and a snap-weldment feature for attachment, allowing for thinner devices without added thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If materials are thinned to reduce device thickness, then device profile is reduced, but torsional and flexural rigidity deteriorates
Solution Approach 1:
The patent transitions from traditional serial stacking (adding thickness in z-direction) to parallel stacking (arranging structural supports in x-y plane). The mid-frame structural support uses parallel extensions in the x and y directions to provide rigidity without increasing device thickness, effectively moving the structural reinforcement strategy to a different dimensional approach.
Solution Approach 2:
The mid-frame structural support is divided into multiple parallel extensions (first extension in x-direction, second extension in y-direction) rather than using a single thick structural element. This segmentation allows the structure to distribute loads across multiple thin components, maintaining rigidity while keeping individual material thicknesses minimal.
2Strength
If mid-frame structural supports are added to provide rigidity, then structural strength is improved, but device thickness increases
Solution Approach 1:
The patent employs thin film-like structural supports that extend parallel to the display surface rather than using thick rigid blocks. The mid-frame structural support consists of thin extensions that provide structural reinforcement through their parallel arrangement and geometric configuration, maintaining the thin-profile characteristic of modern portable devices.
Solution Approach 2:
Instead of adding structural support in the z-direction (thickness), the patent implements support structures that extend in the x-y plane (parallel to display surface). This dimensional shift allows rigidity to be achieved through in-plane extensions rather than out-of-plane thickness addition.
3Area of moving object
If serial stacking of components is used, then device profile is reduced in x and y directions, but device thickness in z direction increases
Solution Approach 1:
The patent addresses the thickness issue caused by serial stacking by introducing mid-frame structural supports that provide rigidity in the x-y plane. This allows thin materials to be used in the z-direction while maintaining structural integrity through parallel extensions in other dimensions, effectively compensating for the thickness penalty of serial stacking.
Data Source
AI summary
Parallel stacking mid-frame structural supports for use with a portable electronic device are presented including: a first side member; a second side member disposed substantially parallel to the first side member, the first member and the second member each configured with; a support feature for providing structural support when an applied load exceeding a predetermined threshold is exerted on the portable electronic device, and an attachment feature; a third side member mechanically contiguous with and disposed substantially perpendicular to the first side member; and a fourth side member mechanically contiguous with and disposed substantially perpendicular to the first side member. In some embodiments, the mid-frame structural support also includes: a first number of rib supports for supporting a printed circuit board (PCB), and a second number of rib supports for supporting the PCB. In some embodiments, the predetermined threshold is approximately 800 grams.