Parallel Tile Synchronization for Accurate Lithography Simulation
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Solution Overview
Problem
Conventional parallel computing solutions for large area lithography simulation face inefficiencies due to tile boundary inconsistencies, which arise from limited information exchange between neighboring tiles, leading to suboptimal results, especially at advanced technology nodes like 5 nm and beyond.
Innovation Solution
A synchronized parallel computing architecture where a manager machine oversees overall algorithms, and worker machines exchange intermediate results to synchronize simulation steps, preventing tile boundary inconsistencies by treating the integrated circuit design layout as a whole and using an underlying tiling scheme to smoothly combine results.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional parallel computing solutions divide the layout into tiles for independent processing, then processing speed is improved, but tile boundary inconsistencies arise due to limited information exchange between neighboring tiles
Solution Approach 1:
The patent introduces a synchronization mechanism that acts as an intermediary between independently processing tiles. Manager machines coordinate intermediate results exchange between worker machines processing different tiles, enabling information flow across tile boundaries while maintaining parallel processing efficiency. This mediator resolves the contradiction by facilitating communication without serializing the entire computation.
Solution Approach 2:
The patent divides the large layout into multiple tiles that can be processed in parallel by different worker machines, improving processing speed. However, it combines segmentation with synchronization points where intermediate results are exchanged, allowing each tile to be independently processed while still maintaining global consistency through coordinated information exchange at boundaries.
2Productivity
If tiles are processed independently in parallel, then computational efficiency is improved, but information exchange between neighboring tiles is limited leading to boundary inconsistencies
Solution Approach 1:
The patent implements a feedback mechanism where intermediate results from each tile are exchanged and used to update subsequent processing. Worker machines send intermediate results to neighboring tiles through manager machines, creating a feedback loop that ensures information from one tile influences adjacent tiles, preventing information loss while maintaining parallel computational efficiency.
3Manufacturing precision
If the entire layout is processed as a whole, then simulation accuracy is improved, but processing time increases significantly
Solution Approach 1:
The patent segments the entire layout into multiple independent tiles that can be processed simultaneously by different worker machines, dramatically reducing processing time compared to processing the entire layout as one unit. The segmentation is combined with synchronization mechanisms to maintain accuracy.
Solution Approach 2:
The patent merges the benefits of independent tile processing with coordinated information exchange. By combining parallel processing of segmented tiles with synchronized intermediate result exchange, the system achieves both the speed of divided processing and the accuracy of holistic simulation.
4Manufacturing precision
If OPC and ILT techniques are applied to compensate for lithography distortions, then pattern fidelity is improved, but process complexity increases
Solution Approach 1:
The patent applies OPC and ILT techniques to individual tiles rather than the entire layout, reducing the computational complexity of each optimization problem while maintaining overall pattern fidelity through synchronized intermediate result exchange between tiles.
Data Source
AI summary
Examples of synchronized parallel tile computation techniques for large area lithography simulation are disclosed herein for solving tile boundary issues. An exemplary method for integrated circuit (IC) fabrication comprises receiving an IC design layout, partitioning the IC design layout into a plurality of tiles, performing a simulated imaging process on the plurality of tiles, generating a modified IC design layout by combining final synchronized image values from the plurality of tiles, and providing the modified IC design layout for fabricating a mask. Performing the simulated imaging process comprises executing a plurality of imaging steps on each of the plurality of tiles. Executing each of the plurality of imaging steps comprises synchronizing image values from the plurality of tiles via data exchange between neighboring tiles.


