Parallel Vacuum Pump Control for Semiconductor Exhaust Power Reduction
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Solution Overview
Problem
The high power consumption of vacuum pumps in substrate processing apparatuses for semiconductor manufacturing is a significant challenge, as it leads to increased operational costs and energy usage without a proportional improvement in processing efficiency.
Innovation Solution
The implementation of a substrate processing apparatus with a gas exhauster system that connects multiple vacuum pumps in parallel to process chambers, allowing for dynamic control of gas flow paths and output rates, enabling efficient exhaust management and reducing power consumption by optimizing vacuum pump usage based on processing needs and detecting abnormalities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If multiple vacuum pumps are connected in parallel to process chambers, then power consumption is reduced through optimized pump usage, but device complexity increases due to additional control mechanisms
Solution Approach 1:
The patent implements dynamic control of vacuum pumps by switching between different operational modes (individual pump control, parallel pump operation, and automatic switching) based on real-time processing requirements. This allows the system to adapt pump configuration dynamically, reducing power consumption by using only necessary pumps at any given moment while maintaining the ability to handle varying vacuum demands.
Solution Approach 2:
The system changes operational parameters by adjusting the number of active vacuum pumps and their output rates based on processing chamber requirements. The control unit monitors vacuum levels and automatically adjusts pump configuration, enabling the system to operate with minimal pumps during low-demand periods and activate additional pumps only when higher vacuum capacity is needed, thereby optimizing energy consumption.
2Productivity
If vacuum pump output is dynamically controlled, then processing efficiency is maintained, but control system complexity increases
Solution Approach 1:
The control unit continuously monitors vacuum pressure levels in process chambers and automatically adjusts vacuum pump output rates and operational status based on real-time feedback. This closed-loop control ensures that vacuum levels remain within required ranges while optimizing pump usage, maintaining processing efficiency without requiring complex manual intervention or over-engineered control systems.
Solution Approach 2:
The system performs self-regulation by automatically switching between different pump configurations and adjusting output rates based on detected vacuum conditions. The control unit autonomously determines when to activate or deactivate individual pumps and adjusts their operational parameters without external intervention, simplifying the overall control architecture while maintaining efficient processing.
3Reliability
If vacuum pump abnormalities are detected and switching is performed, then continuous processing is maintained, but system complexity increases
Solution Approach 1:
The system implements redundancy by having multiple vacuum pumps available that can substitute for each other in case of failure. The control unit continuously monitors pump status and is pre-configured to automatically switch to backup pumps or alternative configurations when abnormalities are detected, ensuring continuous processing without requiring complex emergency response systems or manual intervention.
Solution Approach 2:
The patent combines multiple vacuum pump functions into a unified controlled system where pumps can operate independently or in parallel. By merging the capabilities of multiple pumps under a single control unit that manages switching and load distribution, the system achieves high reliability through redundancy while avoiding the complexity of entirely separate independent systems.
Data Source
AI summary
There is provided a technique that includes: a process chamber in which a substrate is processed; an exhaust controller configured to control a gas flow path through which a plurality of exhausts in parallel is connected to the process chamber and a gas flow in the gas flow path; an output controller configured to control output of each of the exhausts; and a controller configured to be capable of controlling the exhaust controller and the output controller.