Parallel Multi-Wafer Axial Spin Clean Cassette

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Solution Overview

Problem

Current wafer cleaning technologies face throughput limitations and high costs due to the need for single-wafer processing, making multi-wafer parallel processing inefficient and unattractive for investment, despite shrinking chip geometries requiring more processing steps.

Innovation Solution

A system with a cassette structure and processing chamber that allows for simultaneous axial spin cleaning of multiple wafers using rotating chucks with self-locking mechanisms, supported by drive spools and equipped with a nozzle dispense assembly for efficient chemical delivery, enabling concurrent processing of multiple wafers within a single chamber.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If single wafer processing is used, then manufacturing precision is maintained, but productivity is limited

Engineering Contradiction:

Improvewafer processing throughputVSAvoidprocessing system complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The system divides the wafer processing function into multiple independent chucks (first chuck, second chuck, etc.) that can operate simultaneously within a single processing chamber. Each chuck independently holds and processes one wafer, enabling parallel processing of multiple wafers while maintaining the precision of individual wafer handling. This segmentation transforms a single-wafer sequential system into a multi-wafer parallel system.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple chucks and their associated wafer processing functions are merged into a single integrated processing chamber. The chucks are positioned at different locations within the same chamber, allowing simultaneous processing of multiple wafers in one chamber rather than requiring separate chambers for each wafer. This merging increases throughput while avoiding the complexity of multiple independent processing systems.

Inventive Principle:

Principle #5Merging (Combining)

2Productivity

If multi-wafer parallel processing is implemented, then productivity increases, but device complexity and fabrication cost increase

Engineering Contradiction:

Improvewafer processing throughputVSAvoidfabrication cost

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The processing chamber is designed as a universal chamber that can accommodate multiple chucks of the same design, each capable of holding and processing a wafer. The chamber includes multiple nozzle assemblies that can deliver processing fluids to different chuck locations simultaneously. This universal design allows the system to process multiple wafers in parallel using replicated components rather than requiring custom complex mechanisms for each wafer position, thereby reducing fabrication costs while maintaining productivity gains.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Area of stationary object

If chamber stacking is used to reduce footprint, then space utilization improves, but throughput issues persist due to isolated chambers

Engineering Contradiction:

Improvetool footprintVSAvoidwafer processing throughput

Core Design Contradiction:

Area of stationary objectVSProductivity

Solution Approach 1:

Instead of stacking chambers vertically in isolation, the system arranges multiple chucks horizontally within a single chamber at different radial positions. The chucks are positioned around the chamber periphery, with each chuck receiving processing fluids from dedicated nozzle assemblies. This spatial arrangement within a single chamber enables parallel processing without requiring multiple stacked chambers, thereby maintaining throughput while reducing the tool footprint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances throughput by allowing multiple wafers to be processed simultaneously, reducing the need for increased fabrication space and single-wafer tools, while maintaining effective cleaning and wafer positioning through centrifugal force-based self-locking mechanisms.

Implementation Method 1

The self-locking mechanism centers the wafer about an axis of rotation of the upper circular portion and holds the wafer according to a centrifugal force generated by a rotation of the circular plate

Methodology Applied

Scientific EffectCentrifugal force: Centrifugal Force

Data Source

PatentUS9786486B2Parallel multi wafer axial spin clean processing using spin cassette inside movable process chamber

Publication Date: 2017.10.10 SAMSUNG AUSTIN SEMICON LLC

AI summary

A system and method concurrently processes multiple wafers. A cassette structure includes multiple chucks and a drive spool for supporting and rotating the chucks. Each chuck holds a wafer in position while rotating. The cassette structure is loaded into a process chamber. Each chuck includes a self-locking mechanism that is activated by the centrifugal force generated from the rotation of the chuck. The self-locking mechanism centers and holds a wafer in position with respect to the chuck. A drive motor drives the drive spool, which causes the chucks to rotate. As the chucks are being rotated, a dispensing assembly delivers a processing chemical to the wafers.