Partial-Cure Adhesive Fixation for Plastic Inserts in Metal Profiles
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Solution Overview
Problem
In vehicle manufacturing, existing methods for fixing plastic components within metal profiles during processing are energy-intensive and time-consuming, often requiring additional holes or welding points, which create weaknesses in the material and increase production costs.
Innovation Solution
A method using a heat curable adhesive that is only partially cured, covering less than 50% of its surface, to temporarily fix plastic components within metal profiles, allowing for further processing without the need for additional holes or welding, and is fully cured during subsequent e-coat processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the adhesive is fully cured before further processing, then the plastic component is securely fixed, but the energy consumption and processing time increase significantly
Solution Approach 1:
The patent applies partial curing of the adhesive instead of complete curing. The adhesive is cured only to the extent necessary to provide sufficient fixation stability during further processing, rather than achieving full cure. This partial action reduces energy consumption and processing time while maintaining the required fixation reliability.
2Reliability
If clips are used to fix the plastic component, then fixation is achieved, but additional holes are created in the profile reducing structural strength
Solution Approach 1:
The patent replaces the mechanical fixation system (clips requiring holes) with a chemical fixation system (adhesive bonding). The adhesive is applied between the plastic component and the profile, eliminating the need for mechanical clips and the holes they would require, thereby preserving the structural strength of the profile.
3Reliability
If metal brackets are used for fixation, then the plastic component is secured, but welding points are created that weaken the material and additional components increase production costs
Solution Approach 1:
The patent replaces the mechanical bracket fixation system with a chemical adhesive bonding system. This eliminates the need for additional metal bracket components and the welding operations required to attach them, simplifying the device and reducing production complexity while maintaining fixation stability.
4Productivity
If the adhesive is partially cured, then energy and time requirements are minimized, but the fixation strength is reduced compared to full curing
Solution Approach 1:
The patent deliberately applies partial curing of the adhesive, providing just enough bonding strength for the specific processing steps that follow, rather than achieving full cure. This optimization balances processing efficiency with the minimum required fixation strength for the application.
Solution Approach 2:
The patent controls the curing parameters (temperature, time, humidity) to achieve a specific partial cure state that provides adequate fixation strength for further processing. By adjusting these parameters, the adhesive reaches an optimal intermediate state that balances strength development with processing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes energy and time requirements for assembly and e-coat processing, providing a robust temporary fixation that prevents plastic component displacement during processing while maintaining material strength and reducing production costs.
Implementation Method 1
applying heat to the heat curable adhesive only in a portion of less than 50% of the entire surface covered by the heat curable adhesive to cure the adhesive
Implementation Method 2
heat curable adhesive, which is positioned between the substrates 1 and 2, wherein the heat curable adhesive is cured only in a portion of less than 50% of the entire surface covered by the heat curable adhesive
Data Source
Figure 1A~3B
AI summary
The present application is directed at a an assembly comprising a Substrate 1, a Substrate 2 and heat curable adhesive, which is positioned between the Substrates 1 and 2, wherein the heat curable adhesive is cured only in a portion of less than 50% of the entire surface covered by the heat curable adhesive. In this manner, the cured parts of the adhesive serve as "chemical screws" which sufficiently fix the Substrates together during further processing Steps, but do not involve complete curing of the adhesive. Thus, it is possible to use heating Steps in the downstream processing of the Substrate 1/adhesive/substrate 2 assembly to fully cure the adhesive, while the Substrate 2 is sufficiently fixed to the Substrate 1, so that dislocation of the Substrate 2 during the downstream processing is prevented. The present application also provides processes for the preparation of such an assembly as well as the use of the processes in the manufacture of vehicles.