Partial Curing Adhesive for OLED Short-Circuit Prevention

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Organic light emitting diodes (OLEDs) are susceptible to latent short circuits due to substrate roughness and particle inclusions, which can lead to operational failures, and current thick doped hole conductor layers used for protection are costly.

Innovation Solution

A method involving partial curing of an adhesive layer above the substrate or layer in an optoelectronic component, allowing for varying viscosity and inclusion of particles with different refractive indices, and an optically refractive layer on the cover to improve emission characteristics and thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a thick doped hole conductor layer is used as a shorts protection layer, then particle leveling and short-circuit prevention are improved, but manufacturing cost increases and layer thickness increases

Engineering Contradiction:

Improveshort-circuit preventionVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

An adhesive layer with particles having different refractive index is introduced as an intermediary between the substrate and the optoelectronic component layers. This adhesive layer serves as the short-circuit protection mechanism, replacing the need for thick doped hole conductor layers. The particles in the adhesive layer level out substrate roughness and prevent short circuits while maintaining cost-effectiveness.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The refractive index parameter of the adhesive layer is modified by incorporating particles with different refractive indices than the substrate or optoelectronic component layers. This parameter change enables the adhesive layer to effectively prevent short circuits by creating optical contrast that identifies and isolates particle defects, thereby providing protection without requiring thick functional layers.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If a thick doped hole conductor layer is used as a shorts protection layer, then particle leveling is improved, but layer thickness increases

Engineering Contradiction:

Improveparticle levelingVSAvoidlayer thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The adhesive layer acts as an intermediary that performs the particle leveling function. By incorporating particles with different refractive indices, the adhesive layer creates optical contrast that allows for effective identification and management of substrate roughness and particles, achieving leveling without requiring significant thickness.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The adhesive layer is formulated as a composite material containing particles with different refractive indices dispersed within the adhesive matrix. This composite structure provides both the adhesive bonding function and the short-circuit protection function through particle leveling, eliminating the need for separate thick protection layers.

Inventive Principle:

Principle #40Composite materials

3Reliability

If particles with different refractive index are included in the adhesive layer, then short-circuit detection and prevention are improved, but optical homogeneity deteriorates

Engineering Contradiction:

Improveshort-circuit detectionVSAvoidoptical homogeneity

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The particles with different refractive indices are distributed within the adhesive layer to provide localized short-circuit detection and prevention capabilities. The non-uniform distribution of particles creates local optical contrast that enables defect identification, while the overall adhesive layer maintains sufficient optical homogeneity for device operation.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces short-circuit behavior, enhances heat distribution, and potentially reduces the thickness of the hole injection layer, thereby lowering production costs and improving OLED reliability and transparency.

Implementation Method 1

the at least one adhesive is cured only in a partial region above the substrate and/or above the layer

Methodology Applied

Scientific EffectCuring: Photopolymerisation

Implementation Method 2

particles may be provided in the adhesive, said particles having a different refractive index than the adhesive

Methodology Applied

Scientific EffectRefraction: Refraction

Implementation Method 3

an optically refractive layer may be provided on at least one surface of the cover

Methodology Applied

Scientific EffectRefraction: Refraction

Data Source

PatentUS9190628B2Optoelectronic component and method for producing an optoelectronic component

Publication Date: 2015.11.17 DOLYA HOLDCO 5 LTD

AI summary

An optoelectronic component may include: at least one layer of the optoelectronic component; at least one adhesive on the layer of the optoelectronic component; and a cover on the at least one adhesive; wherein the at least one adhesive is cured only in a partial region above at least one of a substrate and the layer.