Partial Electrical Shielding for RF Coils in Communication Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing complexity of electronic communication devices with multiple RF coils leads to significant electromagnetic interference (EMI) or crosstalk, which is challenging to shield effectively due to limited space on the die and the need for partial shielding to maintain additional coil connections.
Innovation Solution
The manufacturing process involves creating multiple vias in a dielectric layer with different planar dimensions, where a seed layer is sputtered and protected to allow for effective shielding of coils within the package, reducing crosstalk and interference by increasing the available area for shielding and isolating coils.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple RF coils are added to electronic communication devices, then communication functionality and RF band coverage are improved, but electromagnetic interference and crosstalk increase significantly
Solution Approach 1:
The patent divides the shielding structure into multiple segments: ground shields between adjacent coils, side shields extending from ground shields, and corner shields at package corners. This segmentation allows each shield element to address specific interference zones, effectively reducing EMI while maintaining multiple RF coil functionality
Solution Approach 2:
The patent introduces ground shields as intermediary structures between adjacent RF coils. These ground shields act as mediators that block electromagnetic coupling between coils, reducing crosstalk and interference without preventing the coils from performing their communication functions
2Object-affected harmful factors
If shielding structures are added to reduce EMI, then electromagnetic interference is reduced, but available area on the die is reduced
Solution Approach 1:
The patent extends shielding structures into the vertical dimension by incorporating side shields that extend from ground shields. This three-dimensional shielding approach reduces EMI effectiveness while minimizing the horizontal footprint on the die, allowing more area for active components
Solution Approach 2:
The patent applies shielding selectively at specific locations where interference is most problematic: between adjacent coils, at package corners, and near sensitive components. This localized shielding approach reduces overall EMI without requiring comprehensive shielding that would consume excessive die area
3Object-affected harmful factors
If complete shielding is implemented to prevent crosstalk, then electromagnetic interference is reduced, but additional coil connections cannot be maintained
Solution Approach 1:
The patent implements partial shielding rather than complete shielding, using ground shields and side shields that address the most critical interference paths. This partial action is sufficient to reduce crosstalk to acceptable levels while leaving space for additional coil connections and maintaining design flexibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces EMI and crosstalk by providing adequate shielding for coils within the package, allowing for greater component integration, reduced fabrication costs, and shorter processing times while maintaining additional coil connections.
Implementation Method 1
a seed layer is sputtered and protected to allow for effective shielding of coils within the package
Data Source
AI summary
A system and method of providing a coil in an electronic communication device in is disclosed. Multiple dielectric layers are deposited and patterned on a semiconductor substrate or insulating mold compound. The dielectric layers provide conductive contact with a contact pad on the underlying structure. Shielding for the coil, including a seed layer covered by an insulating material, is disposed in a via of a lowermost of the dielectric layers. Grounding of the shielding seed layer is through a contact pad on the substrate or a trace between the dielectric layers. A coil is fabricated over the shielding and a solder mask deposited and patterned to cover and insulate the coil. The coil is fabricated in a via of a dielectric layer immediately below the solder mask or above this dielectric layer. Electrical contact is provided by multiple copper and seed layers in the solder mask and dielectric layers.