Partial Electroplating via Moving Electrode and Rail Guide
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Solution Overview
Problem
Existing electroplating techniques face issues with uneven metal deposition quality due to varying electric field intensity, slow operation from forming self-assembled films, and rough surfaces from sliding objects, along with challenges in preventing plating adhesion on electrodes and achieving partial plating without material limitations.
Innovation Solution
An electroplating apparatus with a pair of rails, a plating bath, and a feeder device that positions the processed product with a constricted part between the rails and the center of gravity below, allowing stable movement and partial plating without electrode traces, using electrodes outside the plating solution to maintain consistent deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the processed object is positioned in plating solution, then partial plating can be achieved, but the field intensity from fixed electrode varies according to position causing unevenness in plate quality
Solution Approach 1:
The patent applies the dynamics principle by making the electrode movable rather than fixed. The electrode moves together with the processed object through the plating solution, maintaining a constant distance and relationship. This dynamic configuration ensures uniform field intensity distribution throughout the plating process, eliminating the unevenness problem that occurs with fixed electrodes when objects are positioned at varying depths in the solution.
2Manufacturing precision
If a self-assembled film is formed on the conductive substrate before plating, then unevenness in quality caused by electrode position is prevented, but operating performance is reduced due to the time required to form the film
Solution Approach 1:
The patent eliminates the need for preliminary self-assembled film formation by implementing a different approach: moving the electrode together with the processed object through the plating solution. This preliminary action of configuring the electrode movement mechanism prevents quality unevenness from the outset, without requiring the time-consuming film formation step that previous methods needed to achieve uniform plating.
3Productivity
If electrodes contact the plated object during sliding on rails, then the object can be moved for plating, but the deposited surface becomes rough at the contact position
Solution Approach 1:
The patent applies the taking out principle by removing the harmful contact between electrodes and the processed object during movement. Instead of having electrodes contact the object on rails (which causes surface roughness), the electrode is extracted from the contact path and moved through the plating solution in close proximity to the object without physical contact. This maintains continuous plating capability while preserving surface finish quality.
4Manufacturing precision
If the whole plated object is soaked in plating solution, then plating can be applied, but adhesion occurs on portions that should avoid plating in partial plating applications
Solution Approach 1:
The patent applies the local quality principle by ensuring that only the specific portion of the processed object that needs plating is exposed to the plating solution at any given time. The electrode moves locally along with the target area of the object, applying plating precisely where needed. This eliminates the need for complex masking or positioning systems that would be required to prevent adhesion on non-plating portions while maintaining full plating coverage where required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables continuous, high-quality partial plating with stable posture and clean metal deposition without electrode traces, improving operational efficiency and surface uniformity.
Implementation Method 1
an electroplating apparatus that electroplates a portion of a processed product
Data Source
AI summary
A processed product is continuously partially plated without being covered. Electroplating is carried out on a portion other than a head of a processed product also having a lower part and a constricted part between the head and the lower part. A pair of rails has an opening between the rails narrower than the head and broader than the constricted part, and electrodes are arranged thereon. A plating bath is positioned below the rails, and electrode plates are arranged in a plating solution. The constricted part of the processed product is positioned at the opening between the rails, and a pushing element extending from above the rails through the opening contacts the processed product at a position lower than the center of gravity at the lower part. The pushing element is displaced along the rails to plate a portion of the processed products positioned below the rails.