Partial EMI Shielding Layout for SiP Antenna Signal Transmission
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Solution Overview
Problem
Semiconductor devices, particularly those using system-in-package (SiP) technology, face challenges with electromagnetic interference (EMI) shielding, as conformal EMI shielding layers can obstruct electromagnetic radiation necessary for communication and other functions.
Innovation Solution
The implementation of a partial EMI shielding method using laser ablation, where the EMI shielding layer is partially removed from specific areas of the semiconductor package, allowing for the transmission and reception of electromagnetic signals while maintaining EMI protection where needed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conformal EMI shielding layer is applied over the entire semiconductor package, then EMI protection is improved, but electromagnetic signal transmission is blocked
Solution Approach 1:
The EMI shielding layer is segmented into different regions: a first region over the semiconductor die providing EMI protection, and a second region removed over the antenna trace to enable signal transmission. This segmentation allows simultaneous EMI protection and signal transmission by applying shielding only where needed.
Solution Approach 2:
Different regions of the semiconductor package are assigned different shielding qualities. The region over the semiconductor die maintains full EMI shielding, while the region over the antenna trace is modified to allow electromagnetic signal passage. This local differentiation resolves the contradiction by optimizing each region for its specific function.
2Reliability
If the EMI shielding layer is partially removed to allow signal transmission, then electromagnetic signal transmission is improved, but EMI protection is reduced
Solution Approach 1:
Instead of completely removing the EMI shielding layer, only a portion is removed specifically over the antenna trace where signal transmission is needed. The shielding is maintained in other regions, achieving partial action that balances signal transmission requirements with EMI protection needs.
3Manufacturing precision
If laser ablation is used to remove EMI shielding, then manufacturing precision is improved, but manufacturing complexity increases
Solution Approach 1:
The mechanical process of manually removing or masking EMI shielding is replaced with laser ablation, which uses optical energy to selectively remove material. This substitution enables precise removal of the shielding layer over antenna traces without requiring complex mechanical masking processes, achieving both precision and process integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables improved performance in electronic devices by allowing necessary electromagnetic radiation to pass through while maintaining effective EMI shielding, thus enhancing speed, size, and power efficiency.
Implementation Method 1
partial EMI shielding method using laser ablation, where the EMI shielding layer is partially removed from specific areas of the semiconductor package
Data Source
AI summary
A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.