Partial Outer Metal Layer Formation in Semiconductor Packages
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Solution Overview
Problem
The existing methods for forming a partial outer metal layer in semiconductor packages are time-consuming and prone to misalignment, which can lead to ineffective shielding of electromagnetic wave signals in high-frequency devices like Bluetooth and 5G Wi-Fi applications.
Innovation Solution
A semiconductor package design featuring a substrate with a first and second substrate part, where the second part is narrower, allowing for rapid formation of a metal layer on the exterior sides of the encapsulation corresponding to the chip, and a packaging method involving a substrate with grooves and channels for efficient metal layer deposition and substrate cutting to create multiple packages with a partial outer metal layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If masks are individually aligned to each semiconductor package after attaching to positioning plate, then metal layer can be formed on encapsulation, but the process takes lots of time and is complex
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses in the positioning plate that correspond to the locations of semiconductor packages before metal layer deposition. This allows the metal layer to be formed directly in the correct positions without requiring subsequent mask alignment steps, thereby reducing process time and complexity while maintaining positioning accuracy.
Solution Approach 2:
The patent extracts the mask alignment step from the manufacturing process by using pre-formed recesses in the positioning plate to define metal layer locations. This eliminates the need for separate mask preparation, alignment, and attachment steps, simplifying the overall process while maintaining precision.
2Manufacturing precision
If masks are used to form partial outer metal layer, then metal layer can be deposited on encapsulation, but misalignment may occur causing decreased shielding ability
Solution Approach 1:
The patent applies self-service by designing the positioning plate with pre-formed recesses that automatically define the correct positions for metal layer deposition. The system uses itself (the positioning plate structure) to ensure accurate metal layer placement without requiring external mask alignment, thereby eliminating misalignment errors and ensuring reliable electromagnetic shielding.
Solution Approach 2:
The positioning plate is prepared in advance with recesses at the exact locations where metal layers are needed. This preliminary structuring ensures that when metal is deposited, it automatically forms in the correct positions without requiring subsequent alignment steps, thereby guaranteeing shielding effectiveness.
3Object-affected harmful factors
If multiple masks are prepared and aligned for each semiconductor package, then partial metal shielding can be achieved, but the process complexity increases
Solution Approach 1:
The patent extracts and eliminates the mask preparation and alignment process by using pre-formed recesses in the positioning plate. The recesses directly define where metal layers will be deposited, removing the need for separate mask components and their associated complex handling and alignment procedures, thereby reducing device complexity while maintaining shielding capability.
Solution Approach 2:
The positioning plate structure itself provides the function of mask definition through its pre-formed recesses. This self-service approach eliminates the need for external mask components, simplifying the overall process while achieving the same electromagnetic shielding effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time and complexity of forming a partial outer metal layer, ensuring comprehensive shielding of electromagnetic interference while maintaining high yield and accuracy.
Implementation Method 1
a metal layer covering multiple exterior sides of the encapsulation corresponding to the second substrate part
Data Source
AI summary
A semiconductor package having a partial outer metal layer and packaging method thereof is disclosed. In the method, a specific packaging substrate or a specific positioning plate is used to package multiple semiconductor devices and a partial outer metal layer is quickly formed on an encapsulation of each semiconductor device in the same step.