Partial Molding of PCB Conductors for Voltage Isolation
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Solution Overview
Problem
The existing methods for molding printed circuit board (PCB) substrates with insulators to prevent high voltage interference between conductors result in increased substrate size, inefficient use of insulators, and higher costs, making it difficult to maintain and repair the substrates, especially in limited spaces like battery packs.
Innovation Solution
A partially molded substrate and apparatus that selectively cover and mold only the conductors on a PCB substrate with an insulator, using a sensing unit to identify conductors under high voltage and a molding unit to apply a predetermined thickness of insulator, thereby preventing unnecessary substrate size increase and optimizing insulator use.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the isolation distance between conductors is widened to prevent high voltage interference, then voltage safety is improved, but the size of the PCB substrate is increased
Solution Approach 1:
The patent applies insulator molding selectively only to specific conductors that require high voltage isolation, rather than uniformly increasing the isolation distance across the entire substrate. This localized approach provides the necessary voltage safety for critical conductors while maintaining compact substrate dimensions in non-critical areas.
2Reliability
If the PCB substrate is entirely molded with an insulator to prevent voltage interference, then voltage safety is improved, but the ease of repair is deteriorated due to difficulty in maintaining and repairing parts
Solution Approach 1:
The patent implements partial molding where only specific conductors requiring high voltage isolation are covered with insulator material. This selective approach provides adequate voltage protection for critical conductors while leaving other conductors exposed, thereby maintaining ease of inspection and repair without compromising safety where needed.
3Reliability
If the PCB substrate is entirely molded with an insulator, then voltage interference is prevented, but the manufacturing cost is increased due to inefficient use of insulator material
Solution Approach 1:
The patent applies insulator molding selectively only to specific conductors that require high voltage isolation, rather than uniformly increasing the isolation distance across the entire substrate. This localized approach provides the necessary voltage safety for critical conductors while maintaining compact substrate dimensions in non-critical areas.
Solution Approach 2:
The patent implements partial molding where only specific conductors requiring high voltage isolation are covered with insulator material. This selective approach provides adequate voltage protection for critical conductors while leaving other conductors exposed, thereby maintaining ease of inspection and repair without compromising safety where needed.
4Reliability
If the PCB substrate is entirely molded with an insulator, then voltage interference is prevented, but the substrate thickness is unnecessarily increased
Solution Approach 1:
The patent implements partial molding where only specific conductors requiring high voltage isolation are covered with insulator material. This selective approach provides adequate voltage protection for critical conductors while leaving other conductors exposed, thereby maintaining ease of inspection and repair without compromising safety where needed.
Data Source
AI summary
A partially molded substrate and a partial molding apparatus and a method thereof, which cover and mold each of one or more conductors formed on the substrate with the insulator to prevent the sizes of the substrate from being increased due to molding, thereby efficiently preventing high voltage between the conductors on the substrate from being applied, and thereby preventing interference around the conductor.