Partial Plating Mask Structure for Isolated Circuit Boards
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Solution Overview
Problem
Existing partial plating methods for electrically isolated metal members on insulated boards are inefficient due to complex structures and high production costs, and require extensive time and labor for resist film formation and removal, while also risking electrode marks and plating burns from lead wire connections.
Innovation Solution
A simplified mask for partial plating with a conductive sheet member attached to an insulated sheet member, allowing for selective electroplating without the need for lead wires, using the conductive sheet to connect the metal member to an external power source through the mask's opening, ensuring accurate plating without shielding issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a mask with a built-in conductive member is used for electroplating, then electricity supply to the metal member is achieved without lead wires, but the mask structure becomes complex and production cost increases
Solution Approach 1:
The mask is divided into two separate functional components: an insulated mask body that provides sealing and positioning, and a separate conductive sheet member that provides electricity supply. This segmentation allows each component to be optimized independently, simplifying the overall structure while maintaining functionality.
Solution Approach 2:
The conductive sheet member serves multiple functions: it provides electrical connection to the metal member, acts as a sealing element between the mask and substrate, and enables positioning alignment. This multi-functionality reduces the need for separate components, simplifying the overall mask structure.
2Ease of manufacture
If electroless plating is used to form plating on the metal member, then the process is simpler, but the processing time increases and more chemical solutions are required
Solution Approach 1:
The patent replaces the chemical-based electroless plating process with an electroplating process that uses electrical current. This substitution enables faster plating deposition while reducing chemical solution consumption, thereby improving productivity without significantly complicating the manufacturing process.
3Use of energy by moving object
If lead wires are used to supply electricity to the metal member, then electricity supply is achieved, but electrode marks and plating burns occur
Solution Approach 1:
The conductive sheet member acts as an intermediary between the power source and the metal member. It distributes electrical current over a larger contact area rather than concentrating it at discrete lead wire connection points, thereby preventing electrode marks and plating burns while maintaining effective electricity supply.
4Manufacturing precision
If a resist film is formed and removed for electroless plating, then selective plating is achieved, but much time and labor are required
Solution Approach 1:
The patent extracts and eliminates the resist film formation and removal steps from the plating process. Instead, a mask structure is used that provides selective plating through its physical design, thereby achieving the same manufacturing precision without the time-consuming resist film processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient, accurate, and cost-effective partial electroplating on insulated circuit boards with reduced production time and labor, eliminating electrode marks and plating burns, while maintaining high dimensional accuracy of the plated layer.
Implementation Method 1
the conductive sheet member exposed on the surface of the mask is brought into contact with a portion not to be plated on the surface of the circuit metal member... and an electrode connected to an external power source, so as to supply electricity to the circuit metal member
Implementation Method 2
performing electroplating selectively on a prescribed portion on a surface of one or plural electrically isolated circuit metal members formed on one surface of an insulated board
Data Source
AI summary
A mask for partial plating capable of performing partial electroplating selectively on a prescribed portion on a surface of an electrically isolated metal member provided on an insulated board is provided. Methods for producing an insulated circuit board and using the mask for partial plating are also provided. The mask for partial plating includes an insulated sheet member having an opening corresponding to the portion to be plated, and a structure including a partial region on one surface in the thickness direction of the insulated sheet member being coated with one or plural conductive sheet members attached to the region. The conductive sheet member is adhered to the surface of the insulated sheet member, for example, with an adhesive or an adhesive member. The conductive sheet member may be engaged in a recessed portion formed on the surface of the insulated sheet member.