Partial Wafer Dicing and Transfer Molding for Semiconductor Packages
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Solution Overview
Problem
Conventional encapsulated semiconductor packages are costly to produce and prone to manufacturing defects due to inefficiencies in the die picking and placement process, as well as shifting of individual dies during molding, leading to defective packages.
Innovation Solution
A method involving partial dicing of a wafer, followed by molding and subsequent complete dicing of the molded and partially diced wafer, which includes securing the wafer on a carrier using adhesive or vacuum mechanisms, and using a transfer molding process to encapsulate the diced wafer, thereby reducing production costs and defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional die picking and placement process is used, then individual dies can be placed on carrier, but production cost increases and manufacturing defects occur
Solution Approach 1:
The wafer is partially diced into segments that remain connected by connecting portions, allowing the segments to be molded together as a group rather than handling individual dies. This segmentation approach reduces handling complexity and manufacturing cost while maintaining production efficiency.
Solution Approach 2:
Multiple adjacent dies are merged into a single molded unit by maintaining connecting portions between them during the molding process. This combining approach eliminates the need for individual die placement and reduces manufacturing defects associated with handling separate dies.
2Manufacturing precision
If individual dies are handled during molding, then each die can be positioned, but shifting occurs leading to defective packages
Solution Approach 1:
The wafer is partially diced in advance to create segments with connecting portions, which are then secured to the carrier before molding. This preliminary securing action prevents any shifting during the molding process, ensuring precise positioning and eliminating defects caused by die movement.
Solution Approach 2:
Connecting portions act as intermediaries that maintain the relative positions of adjacent dies throughout the molding process. These connecting structures serve as mediators that prevent shifting and ensure accurate positioning without requiring complex individual die placement mechanisms.
3Ease of operation
If complete dicing is performed before molding, then individual dies are separated, but handling complexity and defects increase
Solution Approach 1:
Instead of performing complete dicing, the process uses partial dicing that creates segments with remaining connecting portions. This partial action approach simplifies handling by reducing the number of completely separate pieces while maintaining enough connectivity to ensure proper molding alignment and reduce defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in lower production costs, faster production time, and a reduced number of defective packages by improving the efficiency of the die handling and molding processes.
Implementation Method 1
securing the wafer on a carrier using adhesive or vacuum mechanisms
Implementation Method 2
securing the wafer on a carrier using adhesive or vacuum mechanisms
Implementation Method 3
using a transfer molding process to encapsulate the diced wafer
Data Source
AI summary
Encapsulated semiconductor packages and methods of production thereof. As a non-limiting example, a semiconductor package may be produced by partially dicing a wafer, molding the partially diced wafer, and completely dicing the molded and partially diced wafer.