Partially Cured Adhesive Structures for Precise Lamination
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Solution Overview
Problem
Existing laminating methods using reactive adhesives face challenges such as material damage from excess adhesive application, visibility of adhesive on surfaces, and adhesive soaking into materials, due to the short pot life of reactive adhesives and the need for direct application.
Innovation Solution
A method involving partial curing of a reactive adhesive formula to form a tack-free adhesive structure, which can be stripped from a base and used in laminating processes, allowing for precise positioning and handling without additional equipment, and enabling three-dimensional shaping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If reactive adhesive is directly applied onto materials to be laminated, then adhesion is improved, but materials may be damaged due to excess adhesive, adhesive on visible surfaces, or adhesive soaking into materials
Solution Approach 1:
The adhesive application process is segmented into two distinct stages: first, applying the reactive adhesive to a carrier film where it can be precisely controlled and partially cured; second, transferring the partially cured adhesive structure to the materials to be laminated. This segmentation prevents direct contact between excess adhesive and the materials, eliminating damage while maintaining adhesion strength.
Solution Approach 2:
The adhesive is applied and partially cured on a carrier film before being transferred to the materials to be laminated. This preliminary action allows the adhesive to reach a tack-free state that prevents soaking into materials while maintaining bonding capability, thus avoiding material damage during the lamination process.
2Duration of action of moving object
If reactive adhesive is directly applied, then bonding is achieved within minutes to hours, but the short pot life requires precise timing and direct application which complicates handling
Solution Approach 1:
A carrier film acts as an intermediary between the adhesive application process and the lamination process. The adhesive is applied to and partially cured on this intermediary carrier film, which protects the adhesive from premature curing while allowing extended handling time. The carrier film is then removed, and the partially cured adhesive structure is transferred to the final substrates, simplifying the overall handling process.
Solution Approach 2:
The adhesive is applied and partially cured in advance on a carrier film, creating a stable, tack-free adhesive structure that can be stored and handled without concern for premature curing. This preliminary action extends the effective working time beyond the traditional pot life limitation, making the process easier to control and execute.
3Productivity
If adhesive is applied directly to materials, then lamination is achieved, but excess adhesive or adhesive on visible surfaces affects product quality
Solution Approach 1:
The adhesive structure is segmented from the final product during the partial curing stage on the carrier film. This allows precise control over adhesive placement and quantity before transfer, ensuring that only the required amount of adhesive contacts the visible surfaces of the laminated product, thereby maintaining high manufacturing precision without compromising lamination efficiency.
Solution Approach 2:
The carrier film serves as an intermediary that enables precise adhesive placement control. By applying and partially curing the adhesive on the carrier film first, the process allows for precise positioning and shaping of the adhesive structure before transfer, preventing excess adhesive from reaching visible surfaces while maintaining efficient lamination production.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for improved handling and precise application of reactive adhesives, minimizing material damage and excess adhesive issues, while enabling efficient lamination processes with three-dimensional adhesive structures.
Implementation Method 1
partial curing the applied reactive adhesive formula to obtain an adhesive structure
Implementation Method 2
The substantially tack-free surface may form due to skinning. I.e. a thin dried film may form on the surface of the applied reactive adhesive formula. This film may form due to cooling (e.g. in case of a hot melt adhesive), due to evaporation of a solvent and/or water (e.g. in case of solvent based or dispersion adhesive), due to chemical reactions
Data Source
Figure 1
Figure 2A~2C
Figure 3~4
AI summary
The present invention relates to a method and a system 1 for forming an adhesive structure for a laminating process, the method including applying a reactive adhesive formula on a base, partial curing 1200 the applied reactive adhesive formula 10 to obtain an adhesive structure 100, and stripping the partially cured adhesive structure 100 from the base.