Partially Encapsulated Cooling Channel for Power Module Heat Management
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Solution Overview
Problem
Current power modules for automotive applications face challenges in reducing manufacturing costs and simplifying the connection of electronic chips while efficiently removing heat generated during operation.
Innovation Solution
A power module design featuring semiconductor chips thermally coupled with cooling channels that allow coolant flow, partially encapsulated by an encapsulant, enabling efficient double-sided cooling through multiple cooling channels on opposing surfaces, promoting heat exchange between the coolant and chip, as well as between the coolant and the environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If cooling channels are fully encapsulated, then manufacturing is simplified and cost is reduced, but heat removal efficiency deteriorates
Solution Approach 1:
The cooling channels are selectively encapsulated: sections adjacent to the electronic chip are enclosed by the encapsulant for manufacturing simplicity, while sections away from the chip remain exposed to the environment for enhanced heat dissipation. This local differentiation of encapsulation quality resolves the contradiction between manufacturing ease and heat removal efficiency.
2Temperature
If multiple cooling channels are added for efficient heat removal, then cooling performance is improved, but device complexity increases
Solution Approach 1:
Multiple cooling channels are integrated into a single encapsulant structure that encloses several channels in a unified manner. This merging approach allows efficient heat removal through multiple channels while maintaining manufacturing simplicity and avoiding excessive structural complexity.
3Temperature
If cooling channels are exposed to environment, then heat exchange with environment is enhanced, but manufacturing complexity increases
Solution Approach 1:
The encapsulant provides selective enclosure: cooling channels adjacent to the chip are enclosed for manufacturing simplicity, while channels away from the chip remain exposed for enhanced heat exchange with the environment. This local differentiation resolves the contradiction between manufacturing ease and heat exchange efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves highly efficient heat removal, suitable for high-heat automotive applications, by integrating partially encapsulated cooling channels on both sides of the chip, enhancing cooling efficiency and allowing the use of vehicle operating liquids as coolant, thus addressing the need for cost-effective and efficient heat management.
Implementation Method 1
at least one cooling channel thermally coupled to the semiconductor chip
Implementation Method 2
a coolant (such as a fluid, i.e. a gas and/or a liquid) is guidable through the at least one cooling channel
Data Source
AI summary
A power module which comprises a semiconductor chip, at least one cooling plate with at least one cooling channel thermally coupled to the semiconductor chip and being configured so that a coolant is guidable through the at least one cooling channel, and an encapsulant encapsulating at least part of the semiconductor chip and part of the at least one cooling channel, wherein at least part of a main surface of the cooling plate forms part of an external surface of the power module.