Partially Fluid-Fillable Circuit With Deformable Conductors

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Solution Overview

Problem

Existing flexible electronic circuits lack the ability to form a sealed, internal cavity that can be filled with fluid, and components with stretchability and durability to maintain reliable electrical function during deformation.

Innovation Solution

A partially fluid-fillable circuit assembly comprising a substrate layer, deformable conductor, and encapsulation layer, with a sealed perimeter defining a fluid-fillable cavity, utilizing deformable conductive materials for traces and vias to maintain electrical connectivity during inflation and deflation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If traditional rigid circuit boards are used, then electrical connectivity is maintained, but flexibility and deformability are lost

Engineering Contradiction:

ImproveflexibilityVSAvoidelectrical connectivity

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent employs flexible substrate layers (such as polyimide or polyester films) that can deform while maintaining structural integrity. These thin film substrates allow the circuit to bend and flex without breaking, solving the contradiction between flexibility and electrical connectivity reliability.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent uses composite material structures combining flexible substrates with conductive trace layers, encapsulation layers, and fluid-fillable cavities. This composite approach enables the circuit to maintain electrical connectivity while achieving the desired flexibility and deformability.

Inventive Principle:

Principle #40Composite materials

2Adaptability or versatility

If stretchable conductive materials are used, then flexibility is improved, but manufacturing precision and durability are reduced

Engineering Contradiction:

ImprovestretchabilityVSAvoidtrace precision

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent employs conductive materials with specific parameter ranges (conductivity, elasticity, viscosity) that maintain manufacturing precision while enabling stretchability. The conductive traces are formulated with controlled physical parameters to ensure both manufacturability and functional reliability during deformation.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent incorporates preliminary encapsulation layers and sealing structures that are formed before final assembly, ensuring that conductive traces are protected and positioned with high precision before the fluid-fillable cavity is sealed. This preliminary action maintains manufacturing precision even with stretchable materials.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If a sealed fluid-fillable cavity is created, then flexibility and durability are improved, but device complexity increases

Engineering Contradiction:

ImprovedurabilityVSAvoidstructural complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the circuit substrate, encapsulation layer, and fluid-fillable cavity into an integrated structure. By combining these elements into a single unified component, the patent reduces overall device complexity while maintaining the sealed cavity necessary for flexibility and durability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The encapsulation layer serves multiple functions simultaneously: it protects the conductive traces, provides structural support, and forms the sealed fluid-fillable cavity. This multi-functionality reduces the need for separate components, thereby reducing device complexity while achieving the desired reliability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Adaptability or versatility

If deformable conductors are used in fluid-fillable circuits, then adaptability is improved, but loss of information (electrical signal integrity) increases

Engineering Contradiction:

ImprovedeformabilityVSAvoidelectrical signal integrity

Core Design Contradiction:

Adaptability or versatilityVSLoss of information

Solution Approach 1:

The patent introduces an intermediary encapsulation layer between the deformable conductive traces and the external environment. This intermediary layer protects the electrical signals from degradation during deformation, maintaining signal integrity while allowing the circuit to deform for flexible applications.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS20250318749A1Devices, systems, and methods for making and using a partially fluid-fillable circuit

Publication Date: 2025.10.16 LIQUID WIRE INC

AI summary

A partially fluid-fillable circuit assembly is disclosed herein. The partially fluid-fillable circuit can include a layup composed of a substrate layer; a deformable conductor; and an encapsulation layer covering the deformable conductor. A first portion of the layup can include a sealed perimeter that, along with at least one surface defined by the layup, can define a first fluid-fillable cavity. A second portion of the layup can be unitized and structurally distinguished from the cavity defined by the first portion of the layup.