Partially Molded Direct Chip Attach Package for EMI Shielding
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Solution Overview
Problem
Current connectivity solutions for microelectronic package structures face challenges in achieving cost-effective, low-profile designs with effective electromagnetic interference (EMI) shielding and flexible routing capabilities, particularly in high-volume manufacturing.
Innovation Solution
The implementation of partially molded direct chip attach (DCA) package structures, which involve a die and components embedded in molding material on a substrate, with a separate substrate providing communication structures and EMI shielding, allowing for flexible design and reduced form factor through the use of embedded trace substrates and offloading tall components to a secondary substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional fully molded package structures are used, then EMI shielding and physical protection are improved, but Z-height increases and routing capacity is limited
Solution Approach 1:
The package structure is divided into two separate substrates: a first substrate containing the die and embedded in molding material, and a second substrate providing EMI shielding and communication structures. This segmentation allows each substrate to be optimized independently, achieving effective EMI shielding without increasing the overall Z-height of the package.
2Adaptability or versatility
If more routing traces are added to a single substrate, then routing capacity is improved, but substrate complexity and manufacturing difficulty increase
Solution Approach 1:
The routing functionality is segmented between two substrates. The first substrate handles signal routing to and from the die, while the second substrate provides additional routing capacity and EMI shielding. This distribution of routing functions across multiple substrates simplifies the manufacturing of each individual substrate while maintaining high overall routing capacity.
3Adaptability or versatility
If tall components are integrated on the same substrate as the die, then device functionality is improved, but form factor increases
Solution Approach 1:
Tall components are relocated from the first substrate to the second substrate, utilizing the vertical stacking dimension. This allows the first substrate to maintain a low profile while the second substrate, positioned above it, accommodates taller components such as antennas and connectors, thereby reducing the overall form factor footprint.
4Ease of manufacture
If PCB based module solutions are used, then manufacturing cost is reduced, but EMI shielding and physical protection are insufficient
Solution Approach 1:
The package structure combines PCB technology with molding material and EMI shielding layers to create a composite structure. The first substrate uses PCB-based construction for cost-effective manufacturing, while the molding material and second substrate provide EMI shielding and physical protection, achieving both cost reduction and improved reliability.
Data Source
AI summary
Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures included herein may include a die on a first substrate, at least one first component adjacent the die on the first substrate, and molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material. A second substrate may be physically coupled to the first substrate. A communication structure may be disposed on a top surface of the second substrate, wherein at least one second component may also be located on the top surface of the second substrate.