Particle Beam Surface Processing with Height Map Feedback
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for processing miniaturized objects using particle beams are time-consuming and often fail to achieve desired results, particularly in manufacturing sectional surfaces and complex geometries due to limitations in orientation and material removal precision.
Innovation Solution
A method involving scanning a particle beam across an object's surface to detect electron emissions, determining height differences, and adjusting processing intensity at specific locations to remove or deposit material, allowing for precise shaping without requiring significant orientation changes between electron and ion beam columns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional ion beam milling methods are used to manufacture sectional surfaces, then material removal can be achieved, but the process is time-consuming and requires frequent orientation changes between electron and ion beam columns
Solution Approach 1:
The patent introduces height information as a third dimension by detecting electron emissions at different intensities from various locations on the object surface. This creates a three-dimensional height map that enables the system to process larger objects with complex geometries without requiring physical reorientation, thereby reducing time loss while maintaining productivity
Solution Approach 2:
The system uses electron emission detection to continuously monitor surface height variations during processing. This feedback mechanism allows real-time adjustment of processing parameters and automatic navigation, eliminating the need for manual orientation changes and significantly reducing processing time while maintaining high productivity
2Manufacturing precision
If the ion beam is oriented nearly parallel to the manufactured sectional surface for material removal, then effective etching can be achieved, but the method is limited to objects with specific orientations and geometries
Solution Approach 1:
The patent applies local quality by detecting electron emissions at each specific location on the object surface and determining height differences individually. This location-specific information allows the system to adapt processing parameters to local surface characteristics, enabling precise etching across diverse orientations and geometries without compromising manufacturing precision
Solution Approach 2:
The system dynamically changes processing parameters based on detected height information. By adjusting beam orientation, focus, and intensity according to the three-dimensional height map, the system can maintain optimal etching conditions across a wide range of surface orientations and geometries, greatly enhancing adaptability while preserving manufacturing precision
3Manufacturing precision
If multiple iterative corrections are performed to achieve desired trench geometry, then manufacturing precision can be improved, but the process becomes extremely time-consuming
Solution Approach 1:
The patent performs preliminary action by detecting the complete three-dimensional height map of the object surface before beginning material removal. This advance knowledge of surface topology allows the system to plan the entire processing path and parameters in advance, achieving high trench geometry accuracy in fewer passes and significantly improving processing efficiency
Solution Approach 2:
The system replaces iterative mechanical repositioning and manual correction with an automated feedback-controlled process. The detected height information drives automatic beam navigation and parameter adjustment, substituting multiple iterative mechanical correction cycles with a single streamlined process that maintains high precision while dramatically improving productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the efficient manufacturing of surfaces with desired shapes and geometries, reducing deviations from target shapes and allowing for the processing of larger objects with complex material distributions, while minimizing the need for orientation changes and reducing processing time.
Implementation Method 1
scanning a particle beam across a surface of the object and detecting electrons emerging from the object due to the scanning
Implementation Method 2
The process gas is activated by the ion beam and causes an etching process. Such method is commonly referred to as ion beam milling or ion beam assisted etching
Data Source
AI summary
A method of processing of an object comprises scanning a particle beam across a surface of the object and detecting electrons emerging from the object due to the scanning; determining a height difference between the surface of the object and a predetermined surface for each of plural of locations on the surface of the object based on the detected electrons; determining a processing intensity for each of the plural locations on the surface of the object based on the determined height differences; and directing a particle beam to the plural locations based on the determined processing intensities, in order to remove material from or deposit material on the object at the plural locations.