Particle Board Surface Treatment Using Recycled Wood Waste
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Solution Overview
Problem
Chipboard surfaces with exposed core layers have large pores, making them difficult to process and finish, as existing methods like hot-melt adhesives and UV varnishes are either flexible or expensive, posing challenges for cost-effective and environmentally friendly surface treatment.
Innovation Solution
A method involving the use of a curable mixture formed by mixing processed material waste, such as wood chips or dust, with a binder, applied to the surface, hardened, and then machined to close pores and improve surface quality, allowing for cost-effective and eco-friendly surface finishing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hot melt adhesive is applied to seal pores, then pore sealing is achieved, but surface flexibility increases making machining difficult
Solution Approach 1:
The patent changes the physical-chemical parameters of the sealing material by using UV-curing lacquer instead of thermoplastic hot melt adhesive. The UV lacquer transitions from liquid to solid state through photopolymerization when exposed to UV radiation, providing rigid pore sealing that maintains good machinability, unlike the flexible thermoplastic adhesive.
2Ease of manufacture
If UV lacquer is used to seal pores, then machinability is improved, but production cost increases
Solution Approach 1:
The patent recycles processing waste material (wood chips, dust, and trimmings) by mixing it with UV lacquer to create the pore-sealing coating. This transforms waste into a valuable resource, significantly reducing material costs while maintaining the machinability benefits of UV-curing technology.
Solution Approach 2:
The patent creates a composite coating material by combining UV lacquer with recycled wood chips and dust. This composite structure provides both the pore-sealing and machinability benefits of UV lacquer while reducing material costs through the inclusion of inexpensive recycled wood particles.
3Ease of manufacture
If UV hot melt adhesive is used to seal pores, then machinability is improved, but material cost increases
Solution Approach 1:
The patent recycles processing waste material (wood chips, dust, and trimmings) by mixing it with UV lacquer to create the pore-sealing coating. This transforms waste into a valuable resource, significantly reducing material costs while maintaining the machinability benefits of UV-curing technology.
Solution Approach 2:
The patent uses inexpensive recycled wood particles as fillers in the UV lacquer coating, replacing expensive pure polymer materials. This approach maintains functional performance while dramatically reducing raw material costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables cost-effective and environmentally friendly surface treatment of chipboard by recycling material waste, improving surface quality and reducing the need for expensive finishing materials, while ensuring dimensional stability and excellent surface properties.
Implementation Method 1
The liquid composition is irradiated with UV radiation until it has cured
Data Source
Figure 1
AI summary
The present invention relates to a method for coating a surface of a workpiece, and to a corresponding apparatus. Such a method and apparatus are used in the building component and furniture industries. The method comprises the steps of providing a material generated during the processing of a semi-finished product, preferably wood material, in particular wood chips or dust; mixing the generated material with a binder to form a curable mixture; and applying the curable mixture to the surface of the workpiece to be coated.