Non-contact Particle Collection via Gas Flow and Ultrasonic Vibration
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Solution Overview
Problem
Conventional particle collecting apparatuses either contaminate or damage semiconductor devices due to contact requirements, or fail to form a sealed space, leading to decreased particle collection efficiency and potential re-contamination.
Innovation Solution
A particle collecting apparatus with a cylindrical housing and annular supply port, featuring a gap forming unit to maintain a predetermined distance from the target object, an ultrasonic wave generator for particle detachment, and a controlled gas flow system to collect particles without direct contact, utilizing a cylindrical member along the central axis to generate ultrasonic waves and create a vortex flow for efficient particle collection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional particle collecting apparatus is brought into contact with the semiconductor device to form a sealed space, then particle collection efficiency is improved, but the semiconductor device may be contaminated or damaged
Solution Approach 1:
The patent introduces a gas flow as an intermediary medium to achieve particle collection without direct contact. Gas is supplied through the supply port to peel particles from the semiconductor device surface, and the same gas flows through the intake port to carry particles away. This gas intermediary eliminates the need for direct contact between the collecting apparatus and the semiconductor device, resolving the contradiction between collection efficiency and device safety
Solution Approach 2:
The patent utilizes pneumatic principles by employing gas flow dynamics to accomplish particle removal. The supply port delivers gas at controlled pressure and flow rate to lift particles from the surface, while the intake port creates a suction flow field. This pneumatic approach enables non-contact particle collection, maintaining both high efficiency and device integrity
2Object-affected harmful factors
If a particle collecting apparatus is used without contact with the semiconductor device, then contamination and damage are avoided, but the sealed space is not formed and particle collection rate decreases
Solution Approach 1:
The patent replaces the mechanical contact-based sealed space formation with a fluid dynamics-based approach. Instead of physically sealing the collection area, the system uses coordinated gas supply and suction to create a controlled flow field that confines particles to the collection path. This substitution maintains non-contact operation while achieving effective particle capture through aerodynamic control
Solution Approach 2:
The patent optimizes collection efficiency by carefully controlling gas flow parameters including flow rate, pressure, and velocity distribution. By adjusting these parameters, the system creates an optimal balance between particle peeling force from the supply port and particle capture efficiency at the intake port, achieving high collection rates without mechanical contact
3Productivity
If gas is supplied from the particle collecting apparatus to peel particles, then particles are removed from the surface, but particles are scattered and another contamination may occur
Solution Approach 1:
The patent merges the particle peeling function and particle collection function into a single integrated gas flow path. The gas that peels particles from the surface continues flowing and directly carries particles into the intake port for removal. This merging eliminates the need for separate peeling and collection operations, preventing particle scattering and re-contamination by maintaining continuous particle containment within the gas stream
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively collects particles on semiconductor devices without contact, enhancing collection efficiency by up to 30% compared to conventional methods, while minimizing contamination and ensuring accurate particle measurement.
Implementation Method 1
The particle collecting apparatus includes an ultrasonic wave generator and can effectively peel off the particles deposited on the surface of the semiconductor device or the like by using an ultrasonic wave emitted from the ultrasonic wave generator
Implementation Method 2
supplies a gas into the sealed space... peeling off the particles deposited on the surface of the semiconductor device or the like by using the supplied gas
Implementation Method 3
the intake port is provided closer to a central axis of the supply port than the supply port and configured to suck particles on the target object
Data Source
AI summary
A particle collecting apparatus includes a cylindrical housing, a gap forming unit, a supply port and an intake port. The cylindrical housing has a closed top and an open bottom facing a target object. The gap forming unit is configured to form a gap having a predetermined distance between the bottom and the target object. The supply port is formed at the opening of the bottom in an annular shape along an inner wall of the housing and configured to supply a gas to the target object. The intake port is provided closer to a central axis of the supply port than the supply port and configured to suck particles on the target object.