Particle and Laser Beam Alignment for Precise Material Removal
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Solution Overview
Problem
Conventional material processing systems face challenges in efficiently exposing regions of interest on objects due to the low material removal rate of ion beams and the lack of precision in laser beam material removal.
Innovation Solution
A material processing method and system that combines the use of particle beam columns, including electron and ion beams, with a laser scanner to achieve rapid and precise material removal. The system allows for the simultaneous use of particle beams and laser beams in overlapping or separate processing regions to optimize material removal rates and precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If material removal is performed using an ion beam, then manufacturing precision is improved, but productivity deteriorates due to low material removal rate
Solution Approach 1:
The patent combines laser beam processing and ion beam processing in a single material processing system. The laser beam performs rough material removal to quickly expose the region of interest, while the ion beam performs precise material removal to achieve the desired precision. This merging of two different processing methods allows the system to overcome the limitations of using either method alone.
2Productivity
If material removal is performed using a laser beam, then productivity is improved due to high material removal rate, but manufacturing precision deteriorates
Solution Approach 1:
The material removal process is segmented into two distinct stages: a first material removal step using the laser beam for rough removal, and a second material removal step using the ion beam for precise removal. This segmentation allows each processing method to be optimized for its specific function, with the laser handling the bulk material removal and the ion beam handling the final precision work.
3Device complexity
If the second processing region overlaps with the first processing region, then device complexity is reduced, but reliability deteriorates due to contamination of particle beam columns
Solution Approach 1:
The laser beam performs material removal in advance to expose the region of interest before the ion beam processing begins. By pre-exposing the region, the subsequent ion beam processing requires less material removal, reducing the time the particle beam columns are exposed to potential contamination from laser-generated particles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables rapid exposure of regions of interest by leveraging the high precision of ion beams and the high material removal rate of laser beams, while minimizing contamination and reducing the time required for material removal.
Implementation Method 1
a laser scanner for directing a laser beam at selectable locations in a second processing region in order to remove material from the object
Implementation Method 2
an ion beam column for directing an ion beam at selectable locations in the first processing region in order to remove material from the object at that location
Implementation Method 3
an electron beam column for scanning an electron beam over a first processing region of an object and detecting electrons generated at the object by the scanning electron beam
Data Source
AI summary
A material processing system includes a particle beam column for directing a particle beam at a first processing region and a laser scanner for directing a laser beam at a second processing region. A method for operating the material processing system includes: scanning a first mark placed on an object with the particle beam; scanning the first mark with the laser beam for a first time and producing a second mark on the object with the laser beam; scanning the second mark with the particle beam; and scanning the first mark with the laser beam for a second time and removing material of the object with the laser beam based on the scanning of the second mark with the particle beam.