Particle Shield Gas Injectors EUV Lithography
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Solution Overview
Problem
In semiconductor manufacturing, particularly in photolithography, particles introduced into the manufacturing environment due to equipment handling or contaminants degrade the quality of the pattern transfer, leading to reduced precision and yield, as they disperse light and adhere to surfaces, obstructing the precise transfer of patterns onto substrates and equipment.
Innovation Solution
A particle shield apparatus is generated using a combination of gas injectors and extractors, creating a laminar flow or magnetic field to prevent particles from adhering to surfaces or entering the optical path, ensuring precise pattern transfer by maintaining a clean environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a solid shield is installed on a wafer transportation/storage pad, then particles are blocked from reaching critical surfaces, but the device complexity and space requirements increase
Solution Approach 1:
The patent employs gas flows (pneumatics) to create particle shields instead of solid physical barriers. Gas injectors deliver controlled gas flows that form protective barriers, while gas extractors remove particles through suction. This pneumatic approach replaces complex solid shield structures with flexible gas-based protection systems that can be precisely controlled and adjusted without adding mechanical complexity.
Solution Approach 2:
The system dynamically adjusts particle shield parameters such as gas flow rate, gas velocity, and extraction strength based on real-time contamination levels and process requirements. By changing these parameters, the system optimizes particle protection effectiveness while minimizing gas consumption and energy usage, avoiding the need for fixed, over-engineered solid shield structures.
2Manufacturing precision
If gas injectors and extractors are used to create particle shields, then manufacturing precision is improved by preventing particle adhesion, but energy consumption increases
Solution Approach 1:
The system applies gas flows and extraction only in specific regions where particle contamination poses the greatest risk to pattern transfer precision, rather than uniformly across the entire wafer surface. Gas injectors are positioned strategically to create localized particle shields only where needed, and extractors are activated only during critical process phases, reducing overall energy consumption while maintaining manufacturing precision.
Solution Approach 2:
The particle shield system operates continuously during critical manufacturing steps to prevent particle adhesion, ensuring uninterrupted protection throughout the pattern transfer process. The gas flows and extraction are maintained at optimized levels throughout the exposure and development cycles, preventing particle contamination without requiring excessive energy spikes or intermittent high-power operation.
3Manufacturing precision
If cleaning solvents are sprayed to remove particles, then surface cleanliness is improved, but the manufacturing process time and complexity increase
Solution Approach 1:
The particle shield system prevents particle contamination before it occurs during the manufacturing process, rather than requiring subsequent cleaning operations. By maintaining protective gas barriers during wafer handling, transportation, and processing, particles are kept away from critical surfaces in advance, eliminating the need for time-consuming solvent cleaning steps and reducing overall manufacturing cycle time.
Solution Approach 2:
The system uses the manufacturing environment's existing gas atmosphere and process gases to create particle shields, rather than requiring separate cleaning solvent systems. The same inert or controlled atmosphere gases used in the manufacturing process are repurposed to form protective barriers, eliminating the need for additional cleaning chemicals and reducing process complexity and time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The particle shield effectively prevents contaminants from reaching critical surfaces, enhancing manufacturing yield and precision by maintaining a clean environment, even in vacuum conditions, and reducing energy loss in EUV lithography systems.
Implementation Method 1
A particle shield generator includes a first component, a second component, and a gas injector configured to generate a particle shield including a laminar flow between the first component and the second component
Implementation Method 2
A particle shield generator includes a first component, a second component, a gas extractor configured to apply a suction force
Implementation Method 3
creating a laminar flow or magnetic field to prevent particles from adhering to surfaces or entering the optical path
Data Source
AI summary
A lithography system includes a radiation source configured to generate a radiation, a reticle configured to redirect the radiation, a first type injection nozzle proximal to the reticle and configured to generate a first particle shield in a propagation path of the radiation, and a second type injection nozzle proximal to the radiation source and configured to generate a second particle shield in the propagation path of the radiation. The second type injection nozzle and the first type injection nozzle are of different types.