Partition Configuration for Alignment Material Containment in LCD Substrates
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Solution Overview
Problem
The existing methods for forming alignment material layers in liquid crystal display panels, such as ink-jet printing, often result in the alignment material covering common paste areas, leading to poor electrical contact and compromised displaying quality due to difficulties in controlling the diffusion of alignment material near edges.
Innovation Solution
The introduction of a partition configuration on the active device array and color filter substrates, which includes an alignment region and a predetermined sealing region, restricts the spread of the alignment material layer, preventing it from covering the common paste areas. This configuration can be a concave or convex structure and is designed to ensure precise placement of the alignment material layer, ensuring proper electrical contact when assembled into a liquid crystal display panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the ink-jet printing method is used to form the alignment material layer, then the film surface accuracy is improved, but the alignment material may still cover the common paste due to uncontrolled diffusion near edges
Solution Approach 1:
The substrate surface is divided into distinct regions: an alignment material deposition region and a common paste region, separated by a partition structure. This segmentation prevents the alignment material from diffusing onto the common paste area, ensuring both film accuracy and electrical contact reliability.
Solution Approach 2:
A partition structure acts as an intermediary barrier between the alignment material deposition region and the common paste region. This partition prevents direct contact between the alignment material and common paste, resolving the contradiction between achieving accurate film deposition and maintaining reliable electrical contact.
2Area of stationary object
If the alignment material is sprayed onto the substrate surface using ink-jet technique, then the alignment material layer can be formed on large substrates, but controlling the diffusion of alignment material near edges becomes difficult
Solution Approach 1:
The substrate is segmented into a defined alignment material deposition region and other regions, with the partition structure creating clear boundaries. This allows ink-jet printing to cover large substrate areas while maintaining precise control over alignment material placement through the partition-defined regions.
Solution Approach 2:
The partition structure is formed in advance before alignment material deposition. This preliminary action establishes the boundaries that will confine the alignment material diffusion, enabling subsequent large-area substrate processing with controlled material placement.
3Ease of manufacture
If no partition configuration is used, then the manufacturing process is simpler, but the alignment material layer cannot be precisely contained within the alignment region
Solution Approach 1:
The partition structure segments the substrate into functional regions, providing precise containment for alignment material while maintaining a relatively simple overall manufacturing process. The partition acts as a built-in boundary that eliminates the need for complex deposition control procedures.
Data Source
AI summary
An active device array substrate comprising a substrate, a pixel array, a partition configuration and an alignment material layer is provided. The substrate has an alignment region and a predetermined sealing region. The predetermined sealing region surrounds the alignment region. The pixel array is disposed on the substrate within the alignment region. The partition configuration is disposed on the substrate between the predetermined sealing region and the alignment region. The alignment material layer is disposed within the alignment region and covers the pixel array.